Dell PowerEdge R250 EMC Technical Specifications - Page 11

Thermal restrictions, Table 18. Particulate contamination specifications

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Table 18. Particulate contamination specifications Particulate contamination Air filtration Conductive dust Corrosive dust Specifications Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV13 filtration. Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and non-data center environments. ● Air must be free of corrosive dust. ● Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and non-data center environments. Table 19. Gaseous contamination specifications Gaseous contamination Copper Coupon Corrosion rate Silver Coupon Corrosion rate Specifications

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Table 18. Particulate contamination specifications
Particulate contamination
Specifications
Air filtration
Data center air filtration as defined by ISO Class 8 per ISO
14644-1 with a 95% upper confidence limit.
NOTE:
This condition applies to data center environments
only. Air filtration requirements do not apply to IT
equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE:
Air entering the data center must have MERV11 or
MERV13 filtration.
Conductive dust
Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE:
This condition applies to data center and non-data
center environments.
Corrosive dust
Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
NOTE:
This condition applies to data center and non-data
center environments.
Table 19. Gaseous contamination specifications
Gaseous contamination
Specifications
Copper Coupon Corrosion rate
<300 Å/month per Class G1 as defined by ANSI/
ISA71.04-2013
Silver Coupon Corrosion rate
<200 Å/month as defined by ANSI/ISA71.04-2013
NOTE:
Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Thermal restrictions
Four fans population is required.
Non Dell qualified peripheral cards or peripheral cards greater than 25 W are not supported.
NOTE:
DIMM blank is not required.
Technical specifications
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