Dell PowerEdge R740xd2 EMC Technical Specifications - Page 15

Table 19. Expansion cards thermal limitation (continued) Thermal Cooling Tier level Bus width Full height Cards Application Restriction (Configuration Type / PCIe slot) 8 x4 - - Half height Cards Application Restriction (Configuration Type / PCIe slot) Intel NVME P4800X Butterfly Riser Configuration / Slot# 3 Particulate and gaseous contamination specifications The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer. Table 20. Particulate contamination specifications Particulate contamination Specifications Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1 with a 95% upper confidence limit. NOTE: This condition applies to data center environments only. Air filtration requirements do not apply to IT equipment designed to be used outside a data center, in environments such as an office or factory floor. NOTE: Air entering the data center must have MERV11 or MERV13 filtration. Conductive dust Air must be free of conductive dust, zinc whiskers, or other conductive particles. NOTE: This condition applies to data center and non-data center environments. Corrosive dust • Air must be free of corrosive dust. • Residual dust present in the air must have a deliquescent point less than 60% relative humidity. NOTE: This condition applies to data center and non-data center environments. Table 21. Gaseous contamination specifications Gaseous contamination Specifications Copper coupon corrosion rate