Foxconn H61AP User manual - Page 9

PRODUCT INTRODUCTION 1-1 Product Specifications CPU Support Intel® Ivy Bridge/Sandy Bridge LGA1155 Processors Max processor power up to 95W For the latest CPU information, please visit: http://www.foxconnsupport.com/cpusupportlist.aspx Chipset Intel® H61 Memory 2 x 240-pin DDR3 DIMMs Support up to 16GB of system memory Dual channel DDR3 1600(Ivy Bridge)/1333/1066 MHz architecture Expansion Slots 1 x PCI Express X16 slot -Support PCI Express Gen2 5GT/s data rate (Sandy Bridge) -Support PCI Express Gen3 8GT/s data rate (Ivy Bridge) 6 x PCI slots Storage Intel® H61 chipset - 4 x SATA 2.0 connectors (3Gb/s data transfer rate) Asmedia ASM1061: - 2 x SATA 3.0 connectors (6Gb/s data transfer rate) (only for H61AP-S) LAN Realtek 8111F Gigabit LAN chip Support 10/100/1000Mbps Audio Realtek ALC662 Audio chip: -High Definition Audio -2/4/5.1-channel -Support for SPDIF Out -Support Jack-Sensing function USB Support up to 10 x USB 2.0 ports (4 rear panel ports, 3 onboard USB headers supporting 6 extra ports) (H61AP) Support up to 8 x USB 2.0 ports (2 rear panel ports, 3 onboard USB headers supporting 6 extra ports)(H61AP-S) Support up to 2 x USB 3.0 ports(only for H61AP-S) Support USB 2.0 protocol up to 480Mb/s Support USB 3.0 protocol up to 5Gb/s Internal Connectors 1 x 24-pin ATX power connector 1 x 4-pin ATX 12V power connector 4 x SATA 2.0 connectors 2 x SATA 3.0 connectors(H61AP-S) 3 x USB 2.0 header (supporting 6 x USB devices) 1 x CPU Fan header (4-pin) 1 x System Fan header (4-pin) 1 x Front panel header 1 x Front Audio header 1 x SPDIF_OUT header 1 x Speaker header 1 x Intrusion Alarm header 1 x COM2 header 1 x TPM header 2