Gigabyte GA-H55M-S2V Manual - Page 10
Product Specifications, Support for DDR3 1666 O.C./1333/1066/800 MHz memory modules - h55
UPC - 818313011244
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1-2 Product Specifications CPU Support for Intel® Core™ i7 processors/Intel® Core™ i5 processors/Intel® Core™ i3 processors/Intel® Pentium® processors in the LGA1156 package (Go to GIGABYTE's website for the latest CPU support list.) L3 cache varies with CPU Chipset Intel® H55 Express Chipset Memory Onboard Graphics Audio 2 x 1.5V DDR3 DIMM sockets supporting up to 16 GB of system memory (Note 1) Dual channel memory architecture Support for DDR3 1666 (O.C.)/1333/1066/800 MHz memory modules Support for non-ECC memory modules Support for Extreme Memory Profile (XMP) memory modules (Go to GIGABYTE's website for the latest supported memory speeds and memory modules.) Integrated in the Chipset: - 1 x DVI-D port j (Note 2)(Note 3) - 1 x D-Sub port (Note 2) Realtek ALC888B codec High Definition Audio 2/4/5.1/7.1-channel (Note 4) LAN 1 x Realtek RTL8111E chip (10/100/1000 Mbit) Expansion Slots 1 x PCI Express x16 slot, running at x16 (The PCIEX16 slot conforms to PCI Express 2.0 standard.) 1 x PCI Express x1 slot 2 x PCI slots Storage Interface Chipset: - 6 x SATA 3Gb/s connectors supporting up to 6 SATA 3Gb/s devices USB Chipset: - Up to 12 USB 2.0/1.1 ports (8 on the back panel, 4 via the USB brackets connected to the internal USB headers) Internal w 1 x 24-pin ATX main power connector Connectors w 1 x 4-pin ATX 12V power connector w 6 x SATA 3Gb/s connectors w 1 x CPU fan header w 1 x system fan header w 1 x front panel header w 1 x front panel audio header w 2 x USB 2.0/1.1 headers w 1 x clearing CMOS jumper j Only for GA-H55M-S2V. Hardware Installation - 10 -