HP 15-g032ds HP 15 TouchSmart Notebook PC HP 15 Notebook PC Compaq 15 TouchSma - Page 73

Heat sink assembly, Keyboard see

Page 73 highlights

Heat sink assembly NOTE: The heat sink assembly spare part kit includes replacement thermal materials. Description Heat sink for use in models with an AMD processor, UMA graphics, and 1 memory slot Heat sink for use in models with an AMD processor, discrete graphics, and 1 memory slot Heat sink for use in models with an AMD processor, discrete graphics, and 2 memory slots Heat sink for use in models with an AMD processor, UMA graphics, and 2 memory slots Spare part number 753895-001 762728-001 788561-001 788562-001 NOTE: To properly ventilate the computer, allow at least 7.6 cm (3.0 in) of clearance on the left side of the computer. The computer uses an electric fan for ventilation. The fan is controlled by a temperature sensor and is designed to turn on automatically when high temperature conditions exist. These conditions are affected by high external temperatures, system power consumption, power management/battery conservation configurations, battery fast charging, and software requirements. Exhaust air is displaced through the ventilation grill located on the left side of the computer. Before removing the heat sink assembly, follow these steps: 1. Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the computer on, and then shut it down through the operating system. 2. Disconnect all external devices connected to the computer. 3. Disconnect the power from the computer by first unplugging the power cord from the AC outlet and then unplugging the AC adapter from the computer. 4. Remove the battery (see Battery on page 35), and then remove the following components: ● Keyboard (see Keyboard on page 39) ● Top cover (see Top cover on page 47) ● WLAN module (see WLAN module on page 55) ● System board (see System board on page 60) To remove the heat sink assembly: 1. Position the system board upside down. 2. Loosen the screws on the heat sink (1) that secure the heat sink assembly to the system board. Component replacement procedures 65

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Heat sink assembly
NOTE:
The heat sink assembly spare part kit includes replacement thermal materials.
Description
Spare part number
Heat sink for use in models with an AMD processor, UMA graphics, and 1 memory slot
753895-001
Heat sink for use in models with an AMD processor, discrete graphics, and 1 memory slot
762728-001
Heat sink for use in models with an AMD processor, discrete graphics, and 2 memory slots
788561-001
Heat sink for use in models with an AMD processor, UMA graphics, and 2 memory slots
788562-001
NOTE:
To properly ventilate the computer, allow at least
7.6 cm
(3.0 in) of clearance on the left side of the
computer. The computer uses an electric fan for ventilation. The fan is controlled by a temperature sensor
and is designed to turn on automatically when high temperature conditions exist. These conditions are
affected by high external temperatures, system power consumption, power management/battery
conservation configurations, battery fast charging, and software requirements. Exhaust air is displaced
through the ventilation grill located on the left side of the computer.
Before removing the heat sink assembly, follow these steps:
1.
Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the
computer on, and then shut it down through the operating system.
2.
Disconnect all external devices connected to the computer.
3.
Disconnect the power from the computer by first unplugging the power cord from the AC outlet and
then unplugging the AC adapter from the computer.
4.
Remove the battery (see
Battery
on page
35
), and then remove the following components:
Keyboard (see
Keyboard
on page
39
)
Top cover (see
Top cover
on page
47
)
WLAN module (see
WLAN module
on page
55
)
System board (see
System board
on page
60
)
To remove the heat sink assembly:
1.
Position the system board upside down.
2.
Loosen the screws on the heat sink
(1)
that secure the heat sink assembly to the system board.
Component replacement procedures
65