HP 15-g057cl HP 15 TouchSmart Notebook PC HP 15 Notebook PC Compaq 15 TouchSma - Page 73
Heat sink assembly, Keyboard see
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Heat sink assembly NOTE: The heat sink assembly spare part kit includes replacement thermal materials. Description Heat sink for use in models with an AMD processor, UMA graphics, and 1 memory slot Heat sink for use in models with an AMD processor, discrete graphics, and 1 memory slot Heat sink for use in models with an AMD processor, discrete graphics, and 2 memory slots Heat sink for use in models with an AMD processor, UMA graphics, and 2 memory slots Spare part number 753895-001 762728-001 788561-001 788562-001 NOTE: To properly ventilate the computer, allow at least 7.6 cm (3.0 in) of clearance on the left side of the computer. The computer uses an electric fan for ventilation. The fan is controlled by a temperature sensor and is designed to turn on automatically when high temperature conditions exist. These conditions are affected by high external temperatures, system power consumption, power management/battery conservation configurations, battery fast charging, and software requirements. Exhaust air is displaced through the ventilation grill located on the left side of the computer. Before removing the heat sink assembly, follow these steps: 1. Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the computer on, and then shut it down through the operating system. 2. Disconnect all external devices connected to the computer. 3. Disconnect the power from the computer by first unplugging the power cord from the AC outlet and then unplugging the AC adapter from the computer. 4. Remove the battery (see Battery on page 35), and then remove the following components: ● Keyboard (see Keyboard on page 39) ● Top cover (see Top cover on page 47) ● WLAN module (see WLAN module on page 55) ● System board (see System board on page 60) To remove the heat sink assembly: 1. Position the system board upside down. 2. Loosen the screws on the heat sink (1) that secure the heat sink assembly to the system board. Component replacement procedures 65