HP BL460c HP BladeSystem c7000 Enclosure technologies,4th edition - Page 1

HP BL460c - ProLiant - G5 Manual

Page 1 highlights

Technologies in the HP BladeSystem c7000 Enclosure technology brief, 4th edition Abstract...3 Overview of HP BladeSystem c7000 Enclosure 3 Enclosure management...5 BladeSystem Onboard Administrator 5 Detecting component insertion and removal 6 Identifying components ...6 Managing power and cooling ...6 Controlling components...7 Redundant enclosure management 8 User interfaces for the BladeSystem Onboard Administrator 8 Security ...8 Role-based user accounts...9 Enclosure linking ...9 ProLiant Onboard Administrator (Integrated Lights-Out 2) for ProLiant server blades 10 Insight Display ...10 HP Insight Control suite ...11 Interconnect options and infrastructure 12 Interconnect modules ...13 Server blades ...14 Storage options inside the BladeSystem enclosure 14 Direct attach storage blades ...14 Shared storage ...15 External SAS connectivity with direct connect SAS storage for HP BladeSystem 15 NAS/SAN Gateway ...15 Storage server...15 Mezzanine cards ...16 Virtual Connect ...16 Fabric connectivity and port mapping 17 c7000 bay-to-bay crosslinks ...19 Device bay crosslinks ...19 Interconnect bay crosslinks ...19 HP Thermal Logic technologies ...20 Active Cool 200 fans ...20 HP PARSEC architecture...21 Parallel...21 Redundant ...23 Scalable ...24 Thermal Logic for the server blade...24 Power supplies and enclosure power subsystem 25 Pooled power ...27

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Abstract
..............................................................................................................................................
3
Overview of HP BladeSystem c7000 Enclosure
.......................................................................................
3
Enclosure management
.........................................................................................................................
5
BladeSystem Onboard Administrator
..................................................................................................
5
Detecting component insertion and removal
.....................................................................................
6
Identifying components
.................................................................................................................
6
Managing power and cooling
.......................................................................................................
6
Controlling components
.................................................................................................................
7
Redundant enclosure management
.................................................................................................
8
User interfaces for the BladeSystem Onboard Administrator
..............................................................
8
Security
.......................................................................................................................................
8
Role-based user accounts
...............................................................................................................
9
Enclosure linking
..........................................................................................................................
9
ProLiant Onboard Administrator (Integrated Lights-Out 2) for ProLiant server blades
...............................
10
Insight Display
...............................................................................................................................
10
HP Insight Control suite
...................................................................................................................
11
Interconnect options and infrastructure
..................................................................................................
12
Interconnect modules
......................................................................................................................
13
Server blades
................................................................................................................................
14
Storage options inside the BladeSystem enclosure
..............................................................................
14
Direct attach storage blades
........................................................................................................
14
Shared storage
..........................................................................................................................
15
External SAS connectivity with direct connect SAS storage for HP BladeSystem
..................................
15
NAS/SAN Gateway
..................................................................................................................
15
Storage server
............................................................................................................................
15
Mezzanine cards
...........................................................................................................................
16
Virtual Connect
..............................................................................................................................
16
Fabric connectivity and port mapping
...............................................................................................
17
c7000 bay-to-bay crosslinks
............................................................................................................
19
Device bay crosslinks
..................................................................................................................
19
Interconnect bay crosslinks
..........................................................................................................
19
HP Thermal Logic technologies
............................................................................................................
20
Active Cool 200 fans
.....................................................................................................................
20
HP PARSEC architecture
..................................................................................................................
21
Parallel
......................................................................................................................................
21
Redundant
.................................................................................................................................
23
Scalable
....................................................................................................................................
24
Thermal Logic for the server blade
....................................................................................................
24
Power supplies and enclosure power subsystem
.................................................................................
25
Pooled power
............................................................................................................................
27
Technologies in the HP BladeSystem c7000
Enclosure
technology brief, 4th edition