HP Dc7900 Testing on HP Business Desktop PCs - Page 5

Mechanical Validation Testing, Module Functional Testing - network controller

Page 5 highlights

• Processor Qualification-This is comprehensive validation and qualification of each unique processor, including all processor frequency changes and all processor stepping changes. Processor qualifications are executed on all supported platforms. • System Memory Qualification-This is comprehensive validation and qualification of each unique memory module. System memory module qualifications are executed on each supported platform. Mechanical Validation Testing This testing focuses on environmental and Industrial Design factors for the chassis, power supply, and system board. Mechanical testing includes form, fit and function tests; paint finish; durability tests; and security tests to help ensure that the product can be assembled correctly. Additional testing includes: • Shock and Vibration Testing-Units are subjected to random vibration and shock to help ensure that the system functions correctly in harsh environments. • Packaging Testing-Boxed systems are subjected to resonance, random vibration, and multiple drops from various heights to help ensure that the packaging can withstand rough handling and protect the system. • Thermal Testing-Each system board, power supply, and integrated subsystem (memory, graphics, audio, NIC, etc.) is tested in elevated ambient, maximum power, and minimum power situations to help ensure that no component temperature specifications are exceeded. • Environmental Testing-Testing is conducted at various temperatures, altitudes, and humidity settings for extended periods of time to help ensure that the system design is reliable in many environments. • Acoustics Testing-This testing helps ensure quiet, reliable products. Acoustic evaluations are performed with typical and power user applications: at idle, when the hard drive is being accessed, and at tonal resonances (noises that could be perceived as adverse by the customer). • Safety/Agency-Systems undergo extensive electromagnetic compatibility and safety testing to help ensure that the product is safe to operate, is environmentally friendly, meets European ergonomic fatigue standards and other various local regulations, does not interfere with radio or TV reception, and is free from interference by external electrical effects. • Power Supply Testing-This testing focuses on the power supply; it includes full electrical verification, voltage regulation, output ripple and noise, stability, input and output transients, stress margins for voltage and current, high-voltage isolation, electro-static discharge, and harmonic current emissions. • Reliability Testing-System and component level testing and modeling is geared towards mitigating risk such as Mean Time Between Failures (MTBF), Strife, High and Low temperature power cycling, long-term reliability, cold/warm boot, AC power on/off, and various other tests. Module Functional Testing This testing focuses on a wide variety of module subsystems to help ensure HP Business Desktop PC standards are met prior to integration into a desktop solution. Module functional testing is conducted on the graphics, audio, network controller, hard drive, optical drive, and input/output device subsystems, as well as on numerous software applications. Testing includes, but is not limited to: • Electric Signal Integrity Testing-This testing helps ensure that the proper signal quality is met on all interfaces and layout routes through the specific module components. • Mechanical Testing-Environmental and design ID testing helps to ensure the proper fit and function and temperature variance tolerance for a module. 5

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Processor Qualification—This is comprehensive validation and qualification of each unique
processor, including all processor frequency changes and all processor stepping changes.
Processor qualifications are executed on all supported platforms.
System Memory Qualification—This is comprehensive validation and qualification of each unique
memory module. System memory module qualifications are executed on each supported platform.
Mechanical Validation Testing
This testing focuses on environmental and Industrial Design factors for the chassis, power supply, and
system board. Mechanical testing includes form, fit and function tests; paint finish; durability tests; and
security tests to help ensure that the product can be assembled correctly. Additional testing includes:
Shock and Vibration Testing—Units are subjected to random vibration and shock to help ensure
that the system functions correctly in harsh environments.
Packaging Testing—Boxed systems are subjected to resonance, random vibration, and multiple
drops from various heights to help ensure that the packaging can withstand rough handling and
protect the system.
Thermal Testing—Each system board, power supply, and integrated subsystem (memory, graphics,
audio, NIC, etc.) is tested in elevated ambient, maximum power, and minimum power situations to
help ensure that no component temperature specifications are exceeded.
Environmental Testing
Testing is conducted at various temperatures, altitudes, and humidity
settings for extended periods of time to help ensure that the system design is reliable in many
environments.
Acoustics Testing—This testing helps ensure quiet, reliable products. Acoustic evaluations are
performed with typical and power user applications: at idle, when the hard drive is being
accessed, and at tonal resonances (noises that could be perceived as adverse by the customer).
Safety/Agency—Systems undergo extensive electromagnetic compatibility and safety testing to
help ensure that the product is safe to operate, is environmentally friendly, meets European
ergonomic fatigue standards and other various local regulations, does not interfere with radio or
TV reception, and is free from interference by external electrical effects.
Power Supply Testing—This testing focuses on the power supply; it includes full electrical
verification, voltage regulation, output ripple and noise, stability, input and output transients, stress
margins for voltage and current, high-voltage isolation, electro-static discharge, and harmonic
current emissions.
Reliability Testing—System and component level testing and modeling is geared towards
mitigating risk such as Mean Time Between Failures (MTBF), Strife, High and Low temperature
power cycling, long-term reliability, cold/warm boot, AC power on/off, and various other tests.
Module Functional Testing
This testing focuses on a wide variety of module subsystems to help ensure HP Business Desktop PC
standards are met prior to integration into a desktop solution. Module functional testing is conducted
on the graphics, audio, network controller, hard drive, optical drive, and input/output device
subsystems, as well as on numerous software applications. Testing includes, but is not limited to:
Electric Signal Integrity Testing—This testing helps ensure that the proper signal quality is met on all
interfaces and layout routes through the specific module components.
Mechanical Testing—Environmental and design ID testing helps to ensure the proper fit and
function and temperature variance tolerance for a module.