HP Integrity rx7640 Site Preparation Guide, Fourth Edition - HP Integrity rx76 - Page 3

Table of Contents, System Bacplane to PCI-X Backplane Connectivity - weight

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Table of Contents About This Document...9 Intended Audience...9 Publishing History...9 Related Information...10 Typographic Conventions...11 HP Encourages Your Comments...12 1 HP Integrity rx7640 Server and HP 9000 rp7440 Server Overview 13 Detailed Server Description...13 Dimensions and Components...14 Front Panel...17 Front Panel Indicators and Controls 17 Enclosure Status LEDs...17 Cell Board...18 PDH Riser Board...19 Central Processor Units...19 Memory Subsystem...20 DIMMs...21 Cells and nPartitions...21 Internal Disk Devices for the Server 22 System Backplane...23 System Bacplane to PCI-X Backplane Connectivity 23 Clocks and Reset...23 I/O Subsystem...23 PCI-X/PCIe Backplane...26 PCI-X/PCIe Slot Boot Paths 27 MP/SCSI Board...28 LAN/SCSI Board...28 Mass Storage (Disk) Backplane 28 2 Server Site Preparation 29 Dimensions and Weights...29 Electrical Specifications...30 Grounding...30 Circuit Breaker...30 System AC Power Specifications...30 Power Cords...30 System Power Specifications...31 Environmental Specifications...32 Temperature and Humidity...32 Operating Environment...32 Environmental Temperature Sensor 33 Non-Operating Environment...33 Cooling...33 Internal Chassis Cooling...33 Bulk Power Supply Cooling...33 PCI/Mass Storage Section Cooling 33 Standby Cooling...33 Typical Power Dissipation and Cooling 33 Table of Contents 3

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Table of Contents
About This Document
.........................................................................................................
9
Intended Audience
.................................................................................................................................
9
Publishing History
..................................................................................................................................
9
Related Information
..............................................................................................................................
10
Typographic Conventions
.....................................................................................................................
11
HP Encourages Your Comments
..........................................................................................................
12
1 HP Integrity rx7640 Server and HP 9000 rp7440 Server Overview
.....................
13
Detailed Server Description
..................................................................................................................
13
Dimensions and Components
.........................................................................................................
14
Front Panel
.......................................................................................................................................
17
Front Panel Indicators and Controls
..........................................................................................
17
Enclosure Status LEDs
...............................................................................................................
17
Cell Board
........................................................................................................................................
18
PDH Riser Board
........................................................................................................................
19
Central Processor Units
..............................................................................................................
19
Memory Subsystem
....................................................................................................................
20
DIMMs
........................................................................................................................................
21
Cells and nPartitions
........................................................................................................................
21
Internal Disk Devices for the Server
................................................................................................
22
System Backplane
............................................................................................................................
23
System Bacplane to PCI-X Backplane Connectivity
...................................................................
23
Clocks and Reset
........................................................................................................................
23
I/O Subsystem
..................................................................................................................................
23
PCI-X/PCIe Backplane
................................................................................................................
26
PCI-X/PCIe Slot Boot Paths
...................................................................................................
27
MP/SCSI Board
...........................................................................................................................
28
LAN/SCSI Board
........................................................................................................................
28
Mass Storage (Disk) Backplane
..................................................................................................
28
2 Server Site Preparation
................................................................................................
29
Dimensions and Weights
......................................................................................................................
29
Electrical Specifications
.........................................................................................................................
30
Grounding
.......................................................................................................................................
30
Circuit Breaker
.................................................................................................................................
30
System AC Power Specifications
.....................................................................................................
30
Power Cords
...............................................................................................................................
30
System Power Specifications
......................................................................................................
31
Environmental Specifications
...............................................................................................................
32
Temperature and Humidity
............................................................................................................
32
Operating Environment
.............................................................................................................
32
Environmental Temperature Sensor
..........................................................................................
33
Non-Operating Environment
.....................................................................................................
33
Cooling
.............................................................................................................................................
33
Internal Chassis Cooling
............................................................................................................
33
Bulk Power Supply Cooling
.......................................................................................................
33
PCI/Mass Storage Section Cooling
.............................................................................................
33
Standby Cooling
.........................................................................................................................
33
Typical Power Dissipation and Cooling
..........................................................................................
33
Table of Contents
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