HP Mini 311-1037TU HP Pavilion dm1 HP Mini 311 Compaq Mini 311 - Maintenance a - Page 85
Step 3 applies to HP Pavilion computer models. See Step 2 for HP Mini and Compaq Mini Computer models.
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Removal and replacement procedures ✎ Step 3 applies to HP Pavilion computer models. See Step 2 for HP Mini and Compaq Mini Computer models. 3. Remove the heat sink assembly 2. ✎ The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time the fan and heat sink are removed: ■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it. ■ Thermal pads are used on the Intel GS45 (8W) chip 3 and the heat sink section 4 that services it. ■ Thermal pads are used on the Southbridge ICH9M chip 5 and the heat sink section 6 that services it. Replacement thermal material is included with all system board and heat sink assembly spare part kits. Reverse this procedure to install heat sink. Maintenance and Service Guide 4-45