HP P6000 HP StorageWorks disk enclosure fan interconnect board replacement ins - Page 2

Verifying component failure, Removing a fan interconnect board, No AC power - hard disk failure warning

Page 2 highlights

4. Remove all cabling from the rear of the enclosure. Ensure all cabling is marked to facilitate re-cabling later. WARNING! A disk enclosure fully populated is heavy. Prior to removing the enclosure from the rack, remove each disk and label it with its bay number. Place each disk on a clean surface. If this is not possible, two people are required to remove the enclosure from the rack to prevent injury. 1. Fan 1 interconnect 2. Fan 2 interconnect board board Figure 1 Fan interconnect board locations 5. Remove hard drives from the enclosure. Press the release button on the drive lever (1), and rotate the lever to the left (2). Then, pull the disk drive out of the drive bays (3), leaving it in the enclosure. Verifying component failure Before replacing the module, check the following and confirm with HP support that it has failed: • Analyze any failure messages received. HP fault monitoring software provides a recommended action. • Check the fan module status LED. Table 1 Fan module status LED descriptions LED status Description Off No AC power Green-blinking Healthy, no fault conditions detected Green-solid The module is being identified Amber-blinking Error, problems detecting the module. Amber-solid Error, fault conditions detected Removing a fan interconnect board 1. Schedule a maintenance window. 2. Stop all I/O to the enclosure. 3. Power down the enclosure by pressing and holding the On/Standby button on the rear of disk enclosure, until the system power LED changes from green to amber. 6. Loosen the thumbscrews that secure the enclosure to the front of the rack, and remove the enclosure from the rack. 7. Remove the top access cover. a. Lift the access panel latch (1). The access panel will slightly disengage from the enclosure. b. Slide the access panel to the rear (2) and lift away from the chassis. NOTE: A Torx tool with T-10 and T-15 ends is provided inside the enclosure chassis, on top of the I/O module housing. Page 2

  • 1
  • 2
  • 3
  • 4

2. Fan 2 interconnect
board
1. Fan 1 interconnect
board
Figure 1 Fan interconnect board locations
Verifying component failure
Before replacing the module, check the following and confirm with HP
support that it has failed:
Analyze any failure messages received. HP fault monitoring software
provides a recommended action.
Check the fan module status LED.
Table 1 Fan module status LED descriptions
Description
LED status
No AC power
Off
Healthy, no fault conditions detected
Green—blink-
ing
The module is being identified
Green—solid
Error, problems detecting the module.
Amber—blink-
ing
Error, fault conditions detected
Amber—solid
Removing a fan interconnect board
1.
Schedule a maintenance window.
2.
Stop all I/O to the enclosure.
3.
Power down the enclosure by pressing and holding the On/Standby
button on the rear of disk enclosure, until the system power LED
changes from green to amber.
4.
Remove all cabling from the rear of the enclosure. Ensure all cabling
is marked to facilitate re-cabling later.
WARNING!
A disk enclosure fully populated is heavy. Prior to
removing the enclosure from the rack, remove each
disk and label it with its bay number. Place each disk
on a clean surface. If this is not possible, two people
are required to remove the enclosure from the rack to
prevent injury.
5.
Remove hard drives from the enclosure.
Press the release button on the drive lever (1), and rotate the lever
to the left (2).
Then, pull the disk drive out of the drive bays (3), leaving it in the
enclosure.
6.
Loosen the thumbscrews that secure the enclosure to the front of the
rack, and remove the enclosure from the rack.
7.
Remove the top access cover.
a.
Lift the access panel latch (1). The access panel will slightly
disengage from the enclosure.
b.
Slide the access panel to the rear (2) and lift away from the
chassis.
NOTE:
A Torx tool with T-10 and T-15 ends is provided inside
the enclosure chassis, on top of the I/O module
housing.
Page 2