HP dx2280 dx2280 Quick Reference Guide - Page 31
End-of-life Management, and Recycling, Hewlett-Packard, Corporate, Environmental, Information
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Quick Specs HP Compaq dx2280 Microtower Business PC Technical Specifications - Environmental Data packaging materials. • Design packaging materials for ease of disassembly. • Maximize the use of post-consumer recycled content materials in packaging materials. • Use readily recyclable packaging materials such as paper and corrugated materials. • Reduce size and weight of packages to improve transportation fuel efficiency. • Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards. End-of-life Management Hewlett-Packard offers end-of-life HP product return and recycling programs and Recycling in many geographic areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner. Hewlett-Packard Corporate Environmental Information For more information about HP's commitment to the environment: [link to new HP white paper now in progress] Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html Eco-label certifications http://www.hp.com/hpinfo/globalcitizenship/ environment/productdesign/ecolabels.html ISO 14001 certificates: http://www.hp.com/hpinfo/globalcitizenship/ environment/operations/envmanagement.html © Copyright 2005 Hewlett-Packard Development Company, L.P. All rights reserved. The information contained herein is subject to change without notice. Intel and Pentium are U.S. registered trademarks of Intel Corporation. Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Rev 2.0 July 07