IBM 7945D2U User Manual - Page 16

IBM System x3650 M3 Specifications - chipset

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Leadership enterprise server with significantly lower cost of ownership in a highly available and expandable, rack-dense, 2U dual-socket server IBM System x3650 M3 Specifications Machine type 7945-12x, 22x, 32x, 52x/54x, 62x, 72x, 82x, D4x, H4x, J4x/J6x/JCx, L4x Form factor 2U Processor types (standard) 6-Core Xeon (E56xx/L56xx/X56xx) 2.26GHz L5640 (H4x), 2.4GHz E5645 (52x/54x), 2.53GHz E5649 (62x), 2.66GHz X5650 (J4x/J6x/JCx), 2.8GHz X5660 (L4x), 3.06GHz X5675 (72x), 3.46GHz X5690 (82x) 4-Core Xeon (E56xx/L56xx/X56xx) 1.6GHz E5603 (12x), 1.86GHz L5609 (CTO), 2.13GHz E5606 (22x), 2.13GHz L5630 (CTO), 2.26GHz E5607 (32x), 2.4GHz E5620 (D4x), 2.93GHz X5647 (CTO), 3.2GHz X5672 (CTO), 3.6GHz X5687 (CTO) Maximum processor power draw QuickPath Interconnect (QPI) speed (gigatransfers per second) 130W-82x (X5647/X5687 via CTO) 95W-72x, J4x/J6x/JCx, L4x, X5672 via CTO) 80W-12x, 22x, 32x, 52x/54x, 62x, D4x 60W- H4x 40W- L5609/L5630 via CTO 6.4GTps (72x, 82x, J4x/J6x/JCx, L4x, X5660/X5672/X5687 via CTO) 5.86GTps (52x/54x, 62x, D4x, H4x, L5630 and X5647 via CTO) 4.8GTps (12x, 22x, 32x, L5609 via CTO) # of processors standard / maximum 2 / 2 (54x, J6x/JCx) 1 / 2 (all other models) Hyper Threading Technology supported Yes (2 threads per core)-52x/54x, 62x, 72x, 82x, D4x, H4x, J4x/J6x/JCx, L4x No-2x, 22x, 32x Turbo Boost Technology supported Yes-52x/54x, 62x, 72x, 82x, D4x, H4x, J4x/J6x/JCx, L4x No-12x, 22x, 32x Internal L3 cache 12MB (1 shared 12MB cache)-(all other models) 8MB (1 shared 8MB cache)-(22x,32x) 4MB (1 shared 4MB cache)-(12x) Chipset BIOS type Standard memory9 (192GB maximum) # of DIMM sockets total / available Memory voltage standard Memory type standard Maximum memory access speed Memory interleaving DIMM types / capacities supported Intel 5520 Unified Extensible Firmware Interface (UEFI) 24GB (6 x 4GB)- J6x/JCx 8GB (2 x 4GB)-54x 4GB (1 x 4GB)-12x, 22x, 32x, 52x, 62x, 72x, 82x, D4x, H4x, J4x, L4x 18 / 12-J6x/JCx 18 / 16-54x 18 / 17-12x, 22x, 32x, 52x, 62x, 72x, 82x, D4x, H4x, J4x, L4x 1.35V Registered PC3-10600 (DDR III ECC (Chipkill protection standard)-Single-rank x4 1333MHz (52x/54x, 62x, 72x, 82x, H4x, J4x/J6x/JCx, L4x) 1066MHz (12x, 22x, 32x, D4x) Yes (two-way using pairs DIMMs) PC3-10600 1333MHz RDIMM 2GB 1R x8 1.35V; 2GB 2R x8 1.35V; 4GB 1R x4 1.35V; 4GB 2R x4 1.35V; 4GB 2R x8 1.35V; PC3-10600 1333MHz UDIMM 2GB 1R x8 1.35V; 4GB 2R x8 1.35V PC3L-8500R 1066MHz RDIMM 8GB 2R x4 1.35V; 16GB 4R x4 1.35V 9 Maximum memory and disk capacity may require the replacement of standard components with the largest supported component available. 16 Please see the Legal Information section for important notices and information.

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Leadership enterprise server with significantly lower cost of ownership in a highly available and
expandable, rack-dense, 2U dual-socket server
Please see the Legal Information section for important notices and information.
16
IBM System x3650 M3 Specifications
Machine type
7945-12x, 22x, 32x, 52x/54x, 62x, 72x, 82x, D4x, H4x, J4x/J6x/JCx, L4x
Form factor
2U
Processor types (standard)
6-Core
Xeon
(E56xx/L56xx/X56xx)
2.26GHz
L5640 (H4x),
2.4GHz
E5645 (52x/54x),
2.53GHz
E5649 (62x),
2.66GHz
X5650 (J4x/J6x/JCx),
2.8GHz
X5660 (L4x),
3.06GHz
X5675 (72x),
3.46GHz
X5690 (82x)
4-Core
Xeon
(E56xx/L56xx/X56xx)
1.6GHz
E5603 (12x),
1.86GHz
L5609 (CTO),
2.13GHz
E5606 (22x),
2.13GHz
L5630 (CTO),
2.26GHz
E5607 (32x),
2.4GHz
E5620 (D4x),
2.93GHz
X5647 (CTO),
3.2GHz
X5672 (CTO),
3.6GHz
X5687 (CTO)
Maximum processor power draw
130W
—82x
(X5647/X5687
via CTO)
95W
—72x,
J4x/J6x/JCx,
L4x, X5672 via
CTO)
80W
—12x,
22x, 32x,
52x/54x,
62x, D4x
60W
H4x
40W
L5609/L5630 via
CTO
QuickPath Interconnect (QPI) speed
(gigatransfers per second)
6.4GTps
(72x, 82x, J4x/J6x/JCx,
L4x, X5660/X5672/X5687
via CTO)
5.86GTps
(52x/54x, 62x, D4x, H4x,
L5630 and X5647 via
CTO)
4.8GTps
(12x, 22x, 32x, L5609 via
CTO)
# of processors standard / maximum
2 / 2 (54x, J6x/JCx)
1 / 2 (all other models)
Hyper Threading Technology supported
Yes (2 threads per core)—52x/54x, 62x,
72x, 82x, D4x, H4x, J4x/J6x/JCx, L4x
No—2x, 22x, 32x
Turbo Boost Technology supported
Yes—52x/54x, 62x, 72x, 82x, D4x, H4x,
J4x/J6x/JCx, L4x
No—12x, 22x, 32x
Internal L3 cache
12MB
(1 shared 12MB
cache)—(all other models)
8MB
(1 shared 8MB
cache)—(22x,32x)
4MB
(1 shared 4MB
cache)—(12x)
Chipset
Intel 5520
BIOS type
Unified Extensible Firmware Interface (
UEFI
)
Standard memory
9
(192GB maximum)
24GB
(6 x 4GB)—
J6x/JCx
8GB
(2 x 4GB)—54x
4GB
(1 x 4GB)—12x, 22x,
32x, 52x, 62x, 72x, 82x,
D4x, H4x, J4x, L4x
# of DIMM sockets total / available
18 /
12
—J6x/JCx
18 /
16
—54x
18 /
17
—12x, 22x, 32x,
52x, 62x, 72x, 82x, D4x,
H4x, J4x, L4x
Memory voltage standard
1.35V
Memory type standard
Registered
PC3-10600 (DDR III ECC (
Chipkill
protection standard)—Single-rank x4
Maximum memory access speed
1333MHz
(52x/54x, 62x, 72x, 82x, H4x,
J4x/J6x/JCx, L4x)
1066MHz
(12x, 22x, 32x, D4x)
Memory interleaving
Yes (two-way using pairs DIMMs)
DIMM types / capacities supported
PC3-10600
1333MHz RDIMM
2GB 1R
x8
1.35V;
2GB 2R
x8
1.35V;
4GB 1R x4 1.35V;
4GB 2R x4 1.35V;
4GB 2R
x8
1.35V;
PC3-10600
1333MHz UDIMM
2GB 1R
x8
1.35V;
4GB 2R
x8
1.35V
PC3L-8500R
1066MHz RDIMM
8GB 2R x4 1.35V;
16GB 4R x4 1.35V
9
Maximum memory and disk capacity may require the replacement of standard components with the largest supported component
available.