Intel BLKD915PGNL Product Specification - Page 83
Thermal Considerations
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Technical Reference 2.12 Thermal Considerations CAUTION A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement. Use a processor heatsink that provides omni-directional airflow (as shown in Figure 27) to maintain required airflow across the processor voltage regulator area. OM16996 Figure 27. Processor Heatsink for Omni-directional Airflow CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that the ambient temperature does not exceed the board's maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.14. 83