Intel BLKDP55KG Product Specification - Page 7

Regulatory Compliance and Battery Disposal Information, s, Tables

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Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance 79 5.1.1 Safety Standards 79 5.1.2 European Union Declaration of Conformity Statement 80 5.1.3 Product Ecology Statements 81 5.1.4 EMC Regulations 85 5.1.5 Product Certification Markings (Board Level 86 5.2 Battery Disposal Information 87 Figures 1. Major Board Components 11 2. Block Diagram 13 3. Memory Channel and DIMM Configuration 17 4. Back Panel Audio Connector Options 23 5. LAN Connector LED Locations 25 6. Thermal Sensors and Fan Headers 28 7. Locations of Indicator LEDs 36 8. Location of the Onboard Power Button 37 9. Detailed System Memory Address Map 40 10. Back Panel Connectors 42 11. Component-side Connectors and Headers 43 12. Connection Diagram for Front Panel Header 50 13. Connection Diagram for Front Panel USB Headers 52 14. Connection Diagram for IEEE 1394a Header 52 15. Location of the Jumper Block 53 16. Board Dimensions 55 17. Localized High Temperature Zones 59 Tables 1. Feature Summary 9 2. Components Shown in Figure 1 12 3. Supported Memory Configurations 15 4. LAN Connector LED States 25 5. Effects of Pressing the Power Switch 29 6. Power States and Targeted System Power 30 7. Wake-up Devices and Events 31 8. System Memory Map 41 9. Component-side Connectors and Headers Shown in Figure 11 44 10. Front Panel Audio Header 45 11. SATA Connectors 45 12. S/PDIF Header 45 13. Chassis Intrusion Header 46 14. Processor, Front and Rear Chassis, and Auxiliary (4-Pin) Fan Headers 46 15. Processor Core Power Connector 48 vii

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Contents
vii
5
Regulatory Compliance and Battery Disposal Information
5.1
Regulatory Compliance
.....................................................................
79
5.1.1
Safety Standards
..................................................................
79
5.1.2
European Union Declaration of Conformity Statement
................
80
5.1.3
Product Ecology Statements
...................................................
81
5.1.4
EMC Regulations
..................................................................
85
5.1.5
Product Certification Markings (Board Level)
.............................
86
5.2
Battery Disposal Information
.............................................................
87
Figures
1.
Major Board Components
..................................................................
11
2.
Block Diagram
................................................................................
13
3.
Memory Channel and DIMM Configuration
...........................................
17
4.
Back Panel Audio Connector Options
..................................................
23
5.
LAN Connector LED Locations
............................................................
25
6.
Thermal Sensors and Fan Headers
.....................................................
28
7.
Locations of Indicator LEDs
...............................................................
36
8.
Location of the Onboard Power Button
................................................
37
9.
Detailed System Memory Address Map
...............................................
40
10. Back Panel Connectors
.....................................................................
42
11. Component-side Connectors and Headers
...........................................
43
12. Connection Diagram for Front Panel Header
........................................
50
13. Connection Diagram for Front Panel USB Headers
................................
52
14. Connection Diagram for IEEE 1394a Header
........................................
52
15. Location of the Jumper Block
.............................................................
53
16. Board Dimensions
...........................................................................
55
17. Localized High Temperature Zones
.....................................................
59
Tables
1.
Feature Summary
..............................................................................
9
2.
Components Shown in Figure 1
.........................................................
12
3.
Supported Memory Configurations
.....................................................
15
4.
LAN Connector LED States
................................................................
25
5.
Effects of Pressing the Power Switch
..................................................
29
6.
Power States and Targeted System Power
...........................................
30
7.
Wake-up Devices and Events
............................................................
31
8.
System Memory Map
.......................................................................
41
9.
Component-side Connectors and Headers Shown in Figure 11
................
44
10. Front Panel Audio Header
.................................................................
45
11. SATA Connectors
.............................................................................
45
12. S/PDIF Header
................................................................................
45
13. Chassis Intrusion Header
..................................................................
46
14.
Processor, Front and Rear Chassis, and Auxiliary (4-Pin)
Fan Headers
...................................................................................
46
15. Processor Core Power Connector
........................................................
48