Intel BLKDX58OG Product Specification - Page 11
Product Description
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1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 2 summarizes the major features of the board. Table 2. Feature Summary Form Factor Processor Memory ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters]) • Intel® Core™ i7 and Intel® Xeon® Processors in an LGA1366 socket • Six 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets • Support for DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and 1066 MHz DIMMs. ― Speeds over 1600 Mhz via XMP profiles • Support for up to 24 GB of system memory with 6 DIMMs using 4 Gb memory technology • Support for ECC and non-ECC memory • XMP version 1.2 Chipset Audio Intel® X58 Chipset, consisting of: • Intel® X58 I/O Hub (IOH) • Intel® 82801IJR I/O Controller Hub (ICH10R) Intel® High Definition Audio subsystem using the Realtek* ALC892 audio codec. Legacy I/O Control Peripheral Interfaces BIOS Instantly Available PC Technology Winbond W83677HG-I legacy I/O controller for Consumer Infrared (CIR) • Two USB 3.0 ports are implemented with stacked back panel connectors (blue) • Twelve USB 2.0 ports: ― Six ports are implemented with stacked back panel connectors (black) ― Six front panel ports implemented through four internal headers • Eight internal SATA interfaces with RAID support: ― Two SATA 6 Gb/s interfaces through Marvel 88SE9128 controller (blue) ― Six SATA 3 Gb/s interfaces through the ICH10R (black) • Two IEEE 1394a ports: ― One port via a back panel connector ― One port via an internal header for front panel cabling • Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device • Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and System Management BIOS (SMBIOS) • Support for PCI Local Bus Specification Revision 2.2 • Support for PCI Express* Revision 2.0 • Suspend to RAM support • Wake on PCI, front panel, CIR, and USB ports continued 11