Intel BOXDP67BA Product Specification - Page 11

1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor Processor Memory Chipset ATX (9.60 inches by 11.60 inches [243.84 millimeters by 294.64 millimeters]) • Intel® Core™ i7, Intel® Core™ i5, and Intel Core™ i3 processors with up to 95W TDP in an LGA1155 socket ― One PCI Express* 2.0 x16 graphics interface ― Integrated memory controller with dual channel DDR3 memory support • Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets • Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs • Support for 1 Gb, 2 Gb, and 4 Gb memory technology • Support for up to 32 GB of system memory with four DIMMs using 4 Gb memory technology • Support for non-ECC memory • Support for 1.35 V low voltage JEDEC memory Intel® P67 Express Chipset consisting of the Intel® P67 Express Platform Controller Hub (PCH) Graphics Audio Peripheral Interfaces Discrete graphics support for PCI Express 2.0 x16 add-in graphics card 10-channel (7.1 + 2) Intel High Definition Audio via the Realtek ALC892 audio codec • Two USB 3.0 ports are implemented with stacked back panel connectors (blue) • Fourteen USB 2.0 ports: ― Six ports are implemented with stacked back panel connectors (black) ― Eight front panel ports implemented through four internal headers • Two Serial ATA (SATA) 6.0 Gb/s interfaces through the Intel P67 Express Chipset with Intel® Rapid Storage Technology RAID support (blue) • Four SATA 3.0 Gb/s interfaces through the Intel P67 Express Chipset with Intel Rapid Storage Technology RAID support: ― Two internal SATA ports (black) ― One internal eSATA port (red) ― One back panel eSATA port (red) • Two IEEE 1394a ports: ― One port via a back panel connector ― One port via an internal header for front panel cabling continued 11