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Thermal Considerations

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Technical Reference 2.12 Thermal Considerations CAUTION A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement. Use a processor heatsink that provides omni-directional airflow (as shown in Figure 31) to maintain required airflow across the processor voltage regulator area. OM16996 Figure 31. Processor Heatsink for Omni-directional Airflow CAUTION Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the desktop board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. 87

Section	Page
Intel® Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification	1
Revision History / Disclaimer	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Other Common Notation	4
Contents	5
1 Product Description	11
1.1 PCI Bus Terminology Change	11
1.2 Board Differences	11
1.3 Overview	12
1.3.1 Feature Summary	12
1.3.2 Manufacturing Options	13
1.3.3 Board Layouts	14
1.3.4 Block Diagram	18
1.4 Online Support	19
1.5 Processor	19
1.6 System Memory	20
1.6.1 Memory Configurations	21
1.7 Intel® 925XE Chipset	25
1.7.1 USB	25
1.7.2 IDE Support	25
1.7.3 Real-Time Clock, CMOS SRAM, and Battery	28
1.8 PCI Express Connectors	28
1.9 Auxiliary Power (AUX PWR) Output Connector	28
1.10 I/O Controller	29
1.10.1 Serial Port	29
1.10.2 Parallel Port	29
1.10.3 Diskette Drive Controller	30
1.10.4 Keyboard and Mouse Interface	30
1.11 Audio Subsystem	31
1.11.1 Audio Subsystem Software	31
1.11.2 Audio Connectors	31
1.11.3 8-Channel (7.1) Audio Subsystem	32
1.11.4 6-Channel (5.1) Audio Subsystem	34
1.12 LAN Subsystem	35
1.12.1 Marvell Yukon 88E8050 PCI Express 1.0a Integrated MAC/PHY Gigabit Ethernet Controller	35
1.12.2 RJ-45 LAN Connector with Integrated LEDs	35
1.12.3 Alert Standard Format (ASF) Support	36
1.12.4 LAN Subsystem Software	36
1.13 Hardware Management Subsystem	37
1.13.1 Hardware Monitoring and Fan Control ASIC	37
1.13.2 Thermal Monitoring	38
1.13.3 Fan Monitoring	40
1.13.4 Chassis Intrusion and Detection	40
1.14 Power Management	40
1.14.1 ACPI	40
1.14.2 Hardware Support	43
1.15 Trusted Platform Module (Optional)	47
1.15.1 System Requirements	47
1.15.2 Warning of Potential Data Loss	47
1.15.3 Security Precautions	48
1.15.4 Trusted Platform Module Ownership	49
1.15.5 Enabling the Trusted Platform Module	50
1.15.6 Assuming Trusted Platform Module Ownership	50
1.15.7 Recovery Procedures	51
1.15.8 Clearing Trusted Platform Module Ownership	52
1.15.9 Software Support	53
2 Technical Reference	55
2.1 Introduction	55
2.2 Memory Resources	55
2.2.1 Addressable Memory	55
2.2.2 Memory Map	57
2.3 DMA Channels	57
2.4 Fixed I/O Map	58
2.5 PCI Configuration Space Map	59
2.6 Interrupts	60
2.7 PCI Conventional Interrupt Routing Map	61
2.8 Connectors	63
2.8.1 Back Panel Connectors	63
2.8.2 Component-side Connectors	68
2.9 Jumper Block	80
2.10 Mechanical Considerations	81
2.10.1 D925XECV2 Form Factor	81
2.10.2 D925XEBC2 Form Factor	82
2.10.3 I/O Shield	83
2.11 Electrical Considerations	85
2.11.1 DC Loading	85
2.11.2 Add-in Board Considerations	85
2.11.3 Fan Connector Current Capability	86
2.11.4 Power Supply Considerations	86
2.12 Thermal Considerations	87
2.13 Reliability	89
2.14 Environmental	90
2.15 Regulatory Compliance	91
2.15.1 Safety Regulations	91
2.15.2 EMC Regulations	91
2.15.3 European Union Declaration of Conformity Statement	92
2.15.4 Product Ecology Statements	93
2.15.5 Product Certification Markings (Board Level)	94
3 Overview of BIOS Features	95
3.1 Introduction	95
3.2 BIOS Flash Memory Organization	96
3.3 Resource Configuration	96
3.3.1 PCI Autoconfiguration	96
3.3.2 PCI IDE Support	96
3.4 System Management BIOS (SMBIOS)	97
3.5 Legacy USB Support	97
3.6 BIOS Updates	98
3.6.1 Language Support	98
3.6.2 Custom Splash Screen	98
3.7 Boot Options	99
3.7.1 CD-ROM Boot	99
3.7.2 Network Boot	99
3.7.3 Booting Without Attached Devices	99
3.7.4 Changing the Default Boot Device During POST	99
3.8 Fast Booting Systems with Intel® Rapid BIOS Boot	100
3.8.1 Peripheral Selection and Configuration	100
3.8.2 Intel Rapid BIOS Boot	100
3.9 BIOS Security Features	101
4 Error Messages and Beep Codes	103
4.1 BIOS Error Messages	103
4.2 Port 80h POST Codes	105
4.3 Bus Initialization Checkpoints	109
4.4 Speaker	110

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Technical Reference

2.12 Thermal Considerations

CAUTION

A chassis with a maximum internal ambient temperature of 38

C at the processor fan inlet is a

requirement.

Use a processor heatsink that provides omni-directional airflow (as shown in

Figure 31) to maintain required airflow across the processor voltage regulator area.

OM16996

Figure 31.

Processor Heatsink for Omni-directional Airflow

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor

and/or voltage regulator or, in some instances, damage to the desktop board.

For a list of chassis

that have been tested with Intel desktop boards please refer to the following website:

http://developer.intel.com/design/motherbd/cooling.htm

All responsibility for determining the adequacy of any thermal or system design remains solely with

the reader.

Intel makes no warranties or representations that merely following the instructions

presented in this document will result in a system with adequate thermal performance.