Intel D925XHY NVIDIA* GeForce* 6200 LE Graphics Card Product Specification - Page 3

Product Details

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2. Product Details 2.1 Graphics Core(GPU) Nvidia GeForce 6200LE Core clock: 350 MHz Voltage: 1.26 V ± 20 mV Package size: 23 mm × 23 mm flip-chip plastic ball grid array (FCPBGA) Number of Pipeline: 4 2.2 Memory Type: 16MB TSOP DDR Memory, 4Mx32 (- 28)x1pcs, memory bandwidth: 32bit • Memory Clock: 275MHz • Memory Adopted: Vendor Part Number Specification Hynix HY5DU283222BFP-28 FBGA144/4Mx32 Hynix HY5DU283222AFP-28 FBGA144/4Mx32 2.3 PCBA- • Form factor o Bracket - ATX Bracket o PCB - Low Profile • Number of layers:4 • PCB Size 6.600x2.713 inch • PCB REV: B Assembly REV: " • Color: Green: • Cooling system: Heatsink • Connectors: DVI-D, D-Sub and 4 mini din for S-Video TVOUT 2.4 Regulatory Standards • CE • FCC 2. Product number & description LR2A1N, GeForce 6200LE, DVI-D/TVOUT/VGA 16M/32bit supporting 128M, 2.6 Hardware Monitor: Supported, and intergrated on chip. Note

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2. Product Details
2.1 Graphics Core(GPU)
Nvidia GeForce 6200LE
Core clock: 350 MHz
Voltage: 1.26 V ± 20 mV
Package size: 23 mm × 23 mm flip-chip plastic ball grid array (FCPBGA)
Number of Pipeline: 4
2.2 Memory
Type: 16MB TSOP DDR Memory, 4Mx32 (– 28)x1pcs, memory bandwidth: 32bit
•
Memory Clock:
275
MHz
•
Memory Adopted:
Vendor
Part Number
Specification
Note
Hynix
HY5DU283222BFP-28
FBGA144/4Mx32
Hynix
HY5DU283222AFP-28
FBGA144/4Mx32
2.3 PCBA—
•
Form factor
o
Bracket – ATX Bracket
o
PCB – Low Profile
•
Number of layers:4
•
PCB Size 6.600x2.713 inch
•
PCB REV: B
Assembly REV:
A2
•
Color: Green:
•
Cooling system: Heatsink
•
Connectors: DVI-D, D-Sub and 4 mini din for S-Video TVOUT
2.4 Regulatory Standards
•
CE
•
FCC
2.
5
Product number & description
LR2A1N, GeForce 6200LE, DVI-D/TVOUT/VGA 16M/32bit supporting 128M,
2.6 Hardware Monitor: Supported, and intergrated on chip.