Intel D945PLRN D945PLRN Technical Product Specification - Page 64

Reliability

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Intel Desktop Board D945PLRN Technical Product Specification Table 33 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 33. Thermal Considerations for Components Component Intel Pentium 4 processor Intel 82945PL MCH Intel 82801G ICH7 Maximum Case Temperature For processor case temperature, see processor datasheets and processor specification updates 103 oC (under bias) 110 oC (under bias, without heatsink) 99 oC (under bias, with heatsink) For information about Intel Pentium 4 processor datasheets and specification updates Refer to Section 1.2, page 15 2.12 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D945PLRN board is 117,195.79 hours. 64

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Intel Desktop Board D945PLRN Technical Product Specification
64
Table 33 provides maximum case temperatures for the components that are sensitive to thermal
changes.
The operating temperature, current load, or operating frequency could affect case
temperatures.
Maximum case temperatures are important when considering proper airflow to cool
the board.
Table 33.
Thermal Considerations for Components
Component
Maximum Case Temperature
Intel Pentium 4 processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel
82945PL MCH
103
o
C (under bias)
Intel 82801G ICH7
110
o
C (under bias, without heatsink)
99
o
C (under bias, with heatsink)
For information about
Refer to
Intel Pentium 4 processor datasheets and specification updates
Section 1.2, page 15
2.12 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates.
The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991.
The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC.
The MTBF for the D945PLRN board is
117,195.79 hours.