Intel DG35EC Product Specification - Page 55

Reliability

Get Intel DG35EC - Desktop Board Classic Series Motherboard PDF manuals and user guides
UPC - 735858200448
View all Intel DG35EC manuals
Add to My Manuals
Save this manual to your list of manuals

Page 55 highlights

Technical Reference Table 28 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 28. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel 82G35 GMCH Intel 82801HB (ICH8) 97 oC (under bias) 92 oC (under bias) For information about Processor datasheets and specification updates Refer to Section 1.2, page 15 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board DG35EC MTBF is 127,118 hours. 55

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
Technical Reference
55
Table 28 provides maximum case temperatures for the board components that are
sensitive to thermal changes.
The operating temperature, current load, or operating
frequency could affect case temperatures.
Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 28. Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel 82G35 GMCH
97
o
C (under bias)
Intel 82801HB (ICH8)
92
o
C (under bias)
For information about
Refer to
Processor datasheets and specification updates
Section 1.2, page 15
2.7
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates.
The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991.
The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC.
The Desktop Board
DG35EC MTBF is 127,118 hours.