Intel DG41BI Product Specification - Page 21
Reliability, 2.6 ACPI Wake-up Devices and Events, Table 16., Thermal Considerations for Components
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Technical Reference Table 16 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 16. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel 82G41 GMCH Intel 82801GB (ICH7) 102 oC (under bias) 108 oC (under bias) 2.5 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. Intel Desktop Board DG41BI MTBF is 197,677 hours. 2.6 ACPI Wake-up Devices and Events Table 17 lists the devices or specific events that can wake the computer from specific states. Table 17. Wake-up Devices and Events These devices/events can wake up the computer... LAN PME# signal Power switch RTC alarm USB WAKE# signal ...from this state S3 and S4 S3 and S4 S1, S3, S4, S5 S3 and S4 S3 S3 and S4 21