Intel DG41CN Product Specification - Page 22

Reliability, ACPI Wake-up Devices and Events

Get Intel DG41CN PDF manuals and user guides View all Intel DG41CN manuals
Add to My Manuals
Save this manual to your list of manuals

Page 22 highlights

Intel Desktop Board DG41CN Technical Product Specification Table 20 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 20. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel 82G41 GMCH Intel 82801GB (ICH7) 102 oC (under bias) 108 oC (under bias) 2.5 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The Intel Desktop Board DG41CN MTBF is 237,188 hours. 2.6 ACPI Wake-up Devices and Events Table 21 lists the devices or specific events that can wake the computer from specific states. Table 21. Wake-up Devices and Events These devices/events can wake up the computer... LAN PME# signal Power switch RTC alarm PS/2 USB WAKE# signal ...from this state S1, S3, S4, and S5 S1, S3, S4, and S5 S1, S3, S4, and S5 S3, S4, and S5 S1, S3, and S5 S3 S1, S3, S4, and S5 22

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
Intel Desktop Board DG41CN Technical Product Specification
22
Table 20 provides maximum case temperatures for the board components that are
sensitive to thermal changes.
The operating temperature, current load, or operating
frequency could affect case temperatures.
Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 20.
Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel 82G41 GMCH
102
o
C (under bias)
Intel 82801GB (ICH7)
108
o
C (under bias)
2.5
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates.
The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991.
The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC.
The Intel Desktop Board
DG41CN MTBF is 237,188 hours.
2.6
ACPI Wake-up Devices and Events
Table 21 lists the devices or specific events that can wake the computer from specific
states.
Table 21.
Wake-up Devices and Events
These devices/events can wake up the computer…
…from this state
LAN
S1, S3, S4, and S5
PME# signal
S1, S3, S4, and S5
Power switch
S1, S3, S4, and S5
RTC alarm
S3, S4, and S5
PS/2
S1, S3, and S5
USB
S3
WAKE# signal
S1, S3, S4, and S5