Intel DG965MS DG965MS Technical Product Specification - Page 7

Regulatory Compliance and Battery Disposal Information, s, Tables - board

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Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance 83 5.1.1 Safety Regulations 83 5.1.2 European Union Declaration of Conformity Statement 84 5.1.3 Product Ecology Statements 86 5.1.4 EMC Regulations 89 5.1.5 Product Certification Markings (Board Level 90 5.2 Battery Disposal Information 91 Figures 1. Major Board Components 12 2. Block Diagram 14 3. Memory Channel Configuration and DIMM Configuration 18 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs 19 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ......... 19 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs 20 7. Single Channel (Asymmetric) Mode Configuration with One DIMM .......... 21 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs....... 21 9. Flex Mode Configuration with Two DIMMs 22 10. Front/Back Panel Audio Connector Options 30 11. LAN Connector LED Locations 31 12. Thermal Sensors and Fan Headers 33 13. Location of the Standby Power Indicator LED 40 14. Detailed System Memory Address Map 42 15. Back Panel Connectors 49 16. Component-side Connectors and Headers 50 17. Connection Diagram for Front Panel Header 56 18. Connection Diagram for Front Panel USB Headers 58 19. Connection Diagram for IEEE 1394a Header 58 20. Location of the Jumper Block 59 21. Board Dimensions 60 22. I/O Shield Dimensions 61 23. Localized High Temperature Zones 65 Tables 1. Feature Summary 10 2. Board Components Shown in Figure 1 13 3. Supported Memory Configurations 16 4. Memory Operating Frequencies 17 5. Audio Jack Retasking Support 29 6. LAN Connector LED States 31 7. Effects of Pressing the Power Switch 34 8. Power States and Targeted System Power 35 9. Wake-up Devices and Events 36 10. System Memory Map 43 vii

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Contents
vii
5
Regulatory Compliance and Battery Disposal Information
5.1
Regulatory Compliance
.....................................................................
83
5.1.1
Safety Regulations
................................................................
83
5.1.2
European Union Declaration of Conformity Statement
................
84
5.1.3
Product Ecology Statements
...................................................
86
5.1.4
EMC Regulations
..................................................................
89
5.1.5
Product Certification Markings (Board Level)
.............................
90
5.2
Battery Disposal Information
.............................................................
91
Figures
1.
Major Board Components
..................................................................
12
2.
Block Diagram
................................................................................
14
3.
Memory Channel Configuration and DIMM Configuration
........................
18
4.
Dual Channel (Interleaved) Mode Configuration with Two DIMMs
............
19
5.
Dual Channel (Interleaved) Mode Configuration with Three DIMMs
.........
19
6.
Dual Channel (Interleaved) Mode Configuration with Four DIMMs
...........
20
7.
Single Channel (Asymmetric) Mode Configuration with One DIMM
..........
21
8.
Single Channel (Asymmetric) Mode Configuration with Three DIMMs
.......
21
9.
Flex Mode Configuration with Two DIMMs
............................................
22
10. Front/Back Panel Audio Connector Options
..........................................
30
11. LAN Connector LED Locations
............................................................
31
12. Thermal Sensors and Fan Headers
.....................................................
33
13. Location of the Standby Power Indicator LED
.......................................
40
14. Detailed System Memory Address Map
...............................................
42
15. Back Panel Connectors
.....................................................................
49
16. Component-side Connectors and Headers
...........................................
50
17. Connection Diagram for Front Panel Header
........................................
56
18. Connection Diagram for Front Panel USB Headers
................................
58
19. Connection Diagram for IEEE 1394a Header
........................................
58
20. Location of the Jumper Block
.............................................................
59
21. Board Dimensions
...........................................................................
60
22. I/O Shield Dimensions
......................................................................
61
23. Localized High Temperature Zones
.....................................................
65
Tables
1.
Feature Summary
............................................................................
10
2.
Board Components Shown in Figure 1
................................................
13
3.
Supported Memory Configurations
.....................................................
16
4.
Memory Operating Frequencies
.........................................................
17
5.
Audio Jack Retasking Support
...........................................................
29
6.
LAN Connector LED States
................................................................
31
7.
Effects of Pressing the Power Switch
..................................................
34
8.
Power States and Targeted System Power
...........................................
35
9.
Wake-up Devices and Events
............................................................
36
10.
System Memory Map
.......................................................................
43