Intel DH55HC Intel Desktop Board DH55HC Technical Product Specification - Page 55

Localized High Temperature Zones, Table 31., Thermal Considerations for Components

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Technical Reference Item A B C Description Processor voltage regulator area Processor Intel H55 Express Chipset Figure 16. Localized High Temperature Zones Table 31 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 31. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel H55 Express Chipset 111 oC (under bias) 55

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Technical Reference
55
Item
Description
A
Processor voltage regulator area
B
Processor
C
Intel H55 Express Chipset
Figure 16.
Localized High Temperature Zones
Table 31 provides maximum case temperatures for the components that are sensitive
to thermal changes.
The operating temperature, current load, or operating frequency
could affect case temperatures.
Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 31.
Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel H55 Express Chipset
111
o
C (under bias)