Intel DH61SKCH Intel Desktop Board DH61SKCH Technical Product Specification - Page 21

Thermal Considerations, Reliability

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Technical Reference 2.4 Thermal Considerations CAUTION All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. Table 18 provides maximum case temperatures for the board components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 18. Thermal Considerations for Components Component Maximum Case Temperature Processor For processor case temperature, see processor datasheets and processor specification updates Intel H61 Chipset 111 oC (under bias) 2.5 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 138,745 hours. 21

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Technical Reference
21
2.4
Thermal Considerations
CAUTION
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader.
Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit.
Table 18 provides maximum case temperatures for the board components that are
sensitive to thermal changes.
The operating temperature, current load, or operating
frequency could affect case temperatures.
Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 18.
Thermal Considerations for Components
Component
Maximum Case Temperature
Processor
For processor case temperature, see processor datasheets and
processor specification updates
Intel H61 Chipset
111
o
C (under bias)
2.5
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates.
The calculation is based on the Telcordia SR-332,
Method I Case 1 50% electrical stress, 55 ºC ambient.
The MTBF prediction is used to
estimate repair rates and spare parts requirements.
The MTBF data is calculated from
predicted data at 55 ºC.
The MTBF for the board is 138,745 hours.