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Intel DZ68DB Product Specification - Page 59

Reliability, Environmental

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Technical Reference 2.7 Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 240,568 hours. 2.8 Environmental Table 35 lists the environmental specifications for the board. Table 35. Environmental Specifications Parameter Temperature Non-Operating Operating Shock Unpackaged Packaged Vibration Unpackaged Packaged Specification -20 °C to +70 °C 0 °C to +55 °C 50 g trapezoidal waveform Velocity change of 170 inches/s² Half sine 2 millisecond Product Weight (pounds) Free Fall (inches)

Section	Page
Intel® Desktop Board DZ68DB Technical Product Specification	1
Revision History	2
Board Identification Information	3
Errata	3
Preface	5
Intended Audience	5
What This Document Contains	5
Typographical Conventions	5
Contents	7
1 Product Description	11
1.1 Overview	11
1.1.1 Feature Summary	11
1.1.2 Board Layout	13
1.1.3 Block Diagram	15
1.2 Legacy Considerations	16
1.3 Online Support	16
1.4 Processor	17
1.4.1 PCI Express x16 Graphics	17
1.5 System Memory	18
1.5.1 Memory Configurations	19
1.6 Intel® Z68 Express Chipset	21
1.7 Graphics Subsystem	21
1.7.1 Integrated Graphics	21
1.7.2 USB	23
1.8 SATA Interfaces	24
1.9 Real-Time Clock Subsystem	25
1.10 Legacy I/O Controller	25
1.10.1 Consumer Infrared (CIR)	25
1.11 Audio Subsystem	26
1.11.1 Audio Subsystem Software	26
1.11.2 Audio Subsystem Components	27
1.12 LAN Subsystem	28
1.12.1 Intel® 82579V Gigabit Ethernet Controller	28
1.12.2 LAN Subsystem Software	29
1.12.3 RJ-45 LAN Connector with Integrated LEDs	29
1.13 Hardware Management Subsystem	30
1.13.1 Hardware Monitoring	30
1.13.2 Fan Monitoring	30
1.13.3 Chassis Intrusion and Detection	30
1.13.4 Thermal Monitoring	31
1.14 Power Management	32
1.14.1 ACPI	32
1.14.2 Hardware Support	34
2 Technical Reference	39
2.1 Memory Resources	39
2.1.1 Addressable Memory	39
2.1.2 Memory Map	41
2.2 Connectors and Headers	41
2.2.1 Back Panel Connectors	42
2.2.2 Component-side Connectors and Headers	43
2.3 Jumper Block	52
2.4 Mechanical Considerations	54
2.4.1 Form Factor	54
2.5 Electrical Considerations	55
2.5.1 Power Supply Considerations	55
2.5.2 Fan Header Current Capability	56
2.5.3 Add-in Board Considerations	56
2.6 Thermal Considerations	56
2.7 Reliability	59
2.8 Environmental	59
3 Overview of BIOS Features	61
3.1 Introduction	61
3.2 BIOS Flash Memory Organization	62
3.3 Resource Configuration	62
3.3.1 PCI Autoconfiguration	62
3.4 System Management BIOS (SMBIOS)	63
3.5 Legacy USB Support	63
3.6 BIOS Updates	64
3.6.1 Language Support	64
3.6.2 Custom Splash Screen	65
3.7 BIOS Recovery	65
3.8 Boot Options	66
3.8.1 Optical Drive Boot	66
3.8.2 Network Boot	66
3.8.3 Booting Without Attached Devices	66
3.8.4 Changing the Default Boot Device During POST	66
3.9 Adjusting Boot Speed	67
3.9.1 Peripheral Selection and Configuration	67
3.9.2 BIOS Boot Optimizations	67
3.10 BIOS Security Features	68
3.11 BIOS Performance Features	69
4 Error Messages and Beep Codes	71
4.1 Speaker	71
4.2 BIOS Beep Codes	71
4.3 Front-panel Power LED Blink Codes	72
4.4 BIOS Error Messages	72
4.5 Port 80h POST Codes	73
5 Regulatory Compliance and Battery Disposal Information	79
5.1 Regulatory Compliance	79
5.1.1 Safety Standards	79
5.1.2 European Union Declaration of Conformity Statement	80
5.1.3 Product Ecology Statements	81
5.1.4 EMC Regulations	83
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance	86
5.1.6 Regulatory Compliance Marks (Board Level)	87