Intel DZ77BH-55K Technical Product Specification - Page 29

Audio Subsystem Components - z77

Get Intel DZ77BH-55K PDF manuals and user guides View all Intel DZ77BH-55K manuals
Add to My Manuals
Save this manual to your list of manuals

Page 29 highlights

Product Description 1.8.2 Audio Subsystem Components The audio subsystem includes the following components: • Intel Z77 Express Chipset • Realtek ALC898 audio codec • Front panel audio header that supports Intel HD audio and AC '97 audio (a 2 x 5- pin header that provides mic in and line out signals for front panel audio connectors) (yellow) • S/PDIF digital audio out header (1 x 4-pin header) (yellow) • S/PDIF digital audio out connector on the back panel • 5-port analog audio input/output stack on the back panel The back panel audio connectors are configurable through the audio device drivers. The available configurable back panel audio connectors are shown in Figure 4. Item A B C D E F Description Rear surround Center channel and LFE (Subwoofer) S/PDIF out (optical) Line in Line out/front speakers Mic in/side surround Figure 4. Back Panel Audio Connectors NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output. For information about The locations of the front panel audio header and S/PDIF audio header The signal names of the front panel audio header and S/PDIF audio header The back panel audio connectors Refer to Figure 13, page 49 Section 2.2.2.1, page 51 Section 2.2.1, page 48 29

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
Product Description
29
1.8.2
Audio Subsystem Components
The audio subsystem includes the following components:
•
Intel Z77 Express Chipset
•
Realtek ALC898 audio codec
•
Front panel audio header that supports Intel HD audio and AC ’97 audio (a 2 x 5-
pin header that provides mic in and line out signals for front panel audio
connectors) (yellow)
•
S/PDIF digital audio out header (1 x 4-pin header) (yellow)
•
S/PDIF digital audio out connector on the back panel
•
5-port analog audio input/output stack on the back panel
The back panel audio connectors are configurable through the audio device drivers.
The available configurable back panel audio connectors are shown in Figure 4.
Item
Description
A
Rear surround
B
Center channel and LFE (Subwoofer)
C
S/PDIF out (optical)
D
Line in
E
Line out/front speakers
F
Mic in/side surround
Figure 4.
Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only.
Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about
Refer to
The locations of the front panel audio header and S/PDIF audio header
Figure 13, page 49
The signal names of the front panel audio header and S/PDIF audio header
Section 2.2.2.1, page 51
The back panel audio connectors
Section 2.2.1, page 48