Intel EM64T User Guide - Page 10
Document Scope - virtualization
UPC - 675900697546
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Introduction R 1.1.3 Document Scope This design guide supports the following processors: • Pentium 4 processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520/521 in the 775land LGA package • Pentium 4 processor 670/672, 660/662, 650, 640, and 630 in the 775-land LGA package • Pentium 4 processor Extreme Edition in the 775-land LGA package In this document, when a reference is made to "the processor" and/or "the Pentium 4 processor in the 775-Land LGA package", it is intended that this includes all the processors supported by this document. If needed for clarity, the specific processor will be listed. In this document, when a reference is made to "the datasheet", the reader should refer to either the Intel® Pentium® 4 Processors 570571, 560/561, 550/551, 540/541, 530/531, and 520/521∆ - On 90 nm Process in the 775-Land LGA Package and Supporting Hyper-Threading Technology Datasheet or the Intel® Pentium® 4 Processor 6xx∆ Sequence and Intel® Pentium® 4 Processor Extreme Edition Datasheet - On 90 nm Process in the 775-land LGA Package, supporting Intel® Extended Memory 64 TechnologyΦ, and supporting Intel® Virtualization Technology as appropriate. If needed for clarity, the specific processor datasheet will be referenced. Chapter 2 discusses package thermal mechanical requirements to design a thermal solution for the Pentium 4 processor in the 775-land LGA package in the context of personal computer applications. Chapter 3 discusses the thermal solution considerations and metrology recommendations to validate a processor thermal solution. Chapter 4 addresses the benefits of the processor's integrated thermal management logic for thermal design. Chapter 5 provides information on the common Intel reference thermal solution for the Pentium 4 processor in the 775-land LGA package discussed in this document. Chapter 6 discusses the implementation of acoustic fan speed control. THE PHYSICAL DIMENSIONS AND THERMAL SPECIFICATIONS OF THE PROCESSOR THAT ARE USED IN THIS DOCUMENT ARE FOR ILLUSTRATION ONLY. REFER TO THE DATASHEET FOR THE PRODUCT DIMENSIONS, THERMAL POWER DISSIPATION AND MAXIMUM CASE TEMPERATURE. IN CASE OF CONFLICT, THE DATA IN THE DATASHEET SUPERSEDES ANY DATA IN THIS DOCUMENT. 10 Thermal/Mechanical Design Guide