Intel MFSYS25V2 Technical Product Specification - Page 15

System Overview

Intel® Modular Server System TPS

8

Revision 1.7

Intel order number E15155-010

switch module is the minimum configuration for external networking, with a second switch

module allowing network redundancy.

See Section 3.6 for a description of this module.

2.3.2.2

Storage Controller Module

The chassis can accommodate up to two hot-swap storage controller modules to support the

external hard disks in the front storage enclosure. One storage controller is the minimum

configuration, with a second storage controller allowing storage controller redundancy. Storage

controller failures are automatically detected and hard drive access is maintained through the

operational storage controller.

See Section 3.7 for a description of this system.

2.3.3

Chassis Management Module

The chassis management module or chassis management module 2, installed in the middle-

rear of the chassis amid the four I/O slots, provides an Internet browser interface that allows for

configuration and management of the entire Intel

®

Modular Server System

MFSYS25/MFSYS35. This module is not redundant, but the system continues to operate

normally should this module fail although any changes to the system configuration cannot be

made until the failed chassis management module is replaced.

Note:

The chassis management module 2 is for Intel

®


MFSYS25V2 only.

See Section 3.5 for a description of this module.

2.3.4

Main Cooling Module

Two hot-swap cooling modules are installed on the left rear of the chassis. Each cooling module

contains two redundant fans that operate in a (1+1) cooling redundancy. Cooling module 1

cools compute modules 1-3; cooling module 2 cools compute modules 4-6.

2.4

Internal Chassis Features

The following figures provide an internal view of how the Intel

®


MFSYS25/MFSYS35

system boards are connected.

Section	Page
Title Page	1
Revision History	2
Table of Contents	3
List of Figures	5
List of Tables	6
1. Product Overview	8
2. System Overview	9
2.1 Introduction	9
2.2 External Chassis Features – Front	12
2.2.1 Compute Module	13
2.2.2 Storage Enclosure	13
2.2.3 I/O Cooling Module	13
2.3 External Chassis Features – Rear	14
2.3.1 Power Supply Module	14
2.3.2 I/O Slots	14
2.3.2.1 Ethernet Switch Module	14
2.3.2.2 Storage Controller Module	15
2.3.3 Chassis Management Module	15
2.3.4 Main Cooling Module	15
2.4 Internal Chassis Features	15
2.4.1 Midplane Board	17
2.4.2 Storage Interposer Board	18
2.5 Mounting and Service Features	18
2.5.1 Chassis	18
2.5.2 Rails	18
2.6 Server Management	18
2.6.1 Chassis Management Module	19
2.6.2 Compute Module Management	19
2.7 Reliability, Availability, Serviceability, Usability, Manageability (RASUM)	20
3. System Details	21
3.1 Specifications	21
3.1.1 Environmental Specifications Summary	21
3.1.2 Physical Specifications Summary	21
3.1.3 Power Specifications Summary	22
3.2 Chassis	23
3.3 Midplane Board	26
3.3.1 Mechanical Outline	26
3.3.2 3D Renderings	27
3.4 Compute Module	28
3.4.1 Introduction	28
3.4.2 Drawings	29
3.5 Chassis Management Module	29
3.5.1 Introduction	29
3.5.1.1 CMM	29
3.5.1.2 CMM2	29
3.5.2 Mechanical Outline	31
3.5.3 Block Diagram	32
3.5.3.1 CMM	32
3.5.3.2 CMM2	32
3.5.4 Drawings	33
3.5.5 Architectural Overview	33
3.6 Ethernet Switch Module	34
3.6.1 Introduction	34
3.6.2 Mechanical Outline	35
3.6.3 Block Diagram	36
3.6.4 Architectural Overview	36
3.7 Storage Controller Module	37
3.7.1 Storage Subsystem Introduction	37
3.7.2 Mechanical Outline	37
3.7.3 Storage Controller Module View	38
3.7.4 Architectural Overview	38
3.7.4.1 Storage Controller Module Interface	38
3.7.4.2 Interposer Card Functionality	38
3.7.4.3 Drive Backplane Interface	39
3.8 Power Supply Module	39
3.9 Jumpers and LEDs	40
4. Product Regulatory Requirements	41
4.1 Product Regulatory Compliance	41
4.1.1 Product Safety Compliance	41
4.1.2 Product EMC Compliance - Class A Compliance	41
4.1.3 Product Ecology Compliance	41
4.1.4 Certifications/Registrations/Declarations	42
4.2 Product Regulatory Compliance Markings	42
4.3 Regulated Specified Components	47
4.4 Electromagnetic Compatibility Notices	48
4.4.1 FCC Verification Statement (USA)	48
4.4.2 ICES-003 (Canada)	49
4.4.3 Europe (CE Declaration of Conformity)	49
4.4.4 VCCI (Japan)	50
4.4.5 BSMI (Taiwan)	50
Glossary	52

Intel MFSYS25V2 Technical Product Specification - Page 15

Internal Chassis Features - storage controller

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