Intel R2000WT Technical Product Specification - Page 44

Intel® Server System R1000WT Product Family TPS

34

Revision 1.0



All externally accessed drive bays must be populated. Drive carriers can be populated with a storage

device (SSD or HDD) or supplied drive blank



With the system operating, the air duct must be installed at all times



In single power supply configurations, the 2

nd

power supply bay must have the supplied filler blank

installed at all times



The system must be configured with dual power supplies for the system to support system fan

redundancy



Fan redundancy is lost if more than one system fan rotor is in a failed state



System fan redundancy is not supported with systems operating at ASHRAE A3 or A4 thermal limits



The system top cover must be installed at all times when the system is in operation

4.2

Thermal Management Overview

In order to maintain the necessary airflow within the system, all of the previously listed components and top

cover need to be properly installed.

For best system performance, the external ambient temperature should

remain below 35

°

C and all system fans should be operational. The system is designed for fan redundancy

when the system is configured with two power supplies, all system fans are present and operational, and

ambient air remains at or below ASHRAE class 2 limits (See table 2). In fan redundancy mode, should a single

system fan rotor failure occur, integrated platform management will: change the state of the System Status

LED to flashing Green, report an error to the system event log, and automatically adjust remaining fan

speeds as needed to maintain system temperatures below maximum thermal limits.

Note

: All system fans are controlled independent of each other. The fan control system may adjust fan

speeds for different fans based on increasing/decreasing temperatures in different thermal zones within the

chassis.

In the event that system temperatures should continue to increase with the system fans operating at their

maximum speed, platform management may begin to throttle bandwidth of either the memory subsystem or

the processors or both, in order to keep components from overheating and keep the system operational.

Throttling of these subsystems will continue until system temperatures are reduced below preprogrammed

limits.

The power supply will be protected against over temperature conditions caused by excessive ambient

temperature. In an over-temperature protection condition, the power supply module will shut down.

Should system thermals increase to a point beyond the maximum thermal limits, the system will shut down,

the System Status LED will change to a solid Amber state, and the event will be logged to the system event

log. Should power supply thermals increase to a point beyond their maximum thermal limits or if a power

supply fan should fail, the power supply will shut down.

Note:

For proper system thermal management, Sensor Data Records (SDRs) for any given system

configuration must be loaded by the system integrator as part of the initial system integration process. SDRs

are loaded using the FRUSDR utility which is part of the System Update Package (SUP) or One-boot Firmware

Update (OFU) package which can be downloaded from the following Intel website:

http://downloadcenter.intel.com

Section	Page
1. Introduction	11
1.1 Chapter Outline	11
1.2 Server Board Use Disclaimer	12
1.3 Product Errata	12
2. Product Family Overview	13
2.1 System Features Overview	15
2.2 Server Board Features Overview	16
2.3 Back Panel Features	19
2.4 Front Control Panel	19
2.5 Front Drive Bay Options	19
2.6 Locking Front Bezel	20
2.7 System Dimensional Data	22
2.7.1 Chassis Dimensions	22
2.7.2 Label Emboss Dimensions	23
2.7.3 Pull-out Tab Label Emboss Dimensions	24
2.8 System Cable Routing Channels	25
2.9 Available Rack and Cabinet Mounting Kit Options	26
2.10 System Level Environmental Limits	27
3. System Power	28
3.1 Power Supply Configurations	28
3.2 Power Supply Module Options	29
3.2.1 Power Supply Module Efficiency	29
3.2.2 Power Supply Module Mechanical Overview	29
3.2.3 Power Cord Specification Requirements	30
3.3 AC Power Supply Input Specifications	31
3.3.1 Power Factor	31
3.3.2 AC Input Voltage Specification	31
3.3.3 AC Line Isolation Requirements	32
3.3.4 AC Line Dropout / Holdup	32
3.3.4.1 AC Line 12VSBHoldup	32
3.3.5 AC Line Fuse	32
3.3.6 AC Inrush	32
3.3.7 AC Line Transient Specification	32
3.3.8 Susceptibility Requirements	33
3.3.9 Electrostatic Discharge Susceptibility	33
3.3.10 Fast Transient/Burst	33
3.3.11 Radiated Immunity	33
3.3.12 Surge Immunity	33
3.3.13 Power Recovery	34
3.3.14 Voltage Interruptions	34
3.3.15 Protection Circuits	34
3.3.15.1 Over-current Protection (OCP)	34
3.3.15.2 Over-voltage Protection (OVP)	34
3.3.15.3 Over-temperature Protection (OTP)	34
3.3.16 Power Supply Status LED	35
3.4 DC Power Supply Input Specifications	35
3.4.1 DC Input Voltage	35
3.4.2 DC Input Fuse	35
3.4.3 DC Inrush Current	35
3.4.4 DC Input Under Voltage	36
3.4.5 DC Holdup Time and Dropout	36
3.4.6 DC Line Surge Voltages (Line Transients)	36
3.4.7 Susceptibility Requirements	36
3.4.7.1 Electrostatic Discharge Susceptibility	37
3.4.7.2 Fast Transient/Burst	37
3.4.7.3 Radiated Immunity	37
3.4.7.4 Surge Immunity	37
3.4.8 Protection Circuits	37
3.4.8.1 Current Limit (OCP)	37
3.4.8.2 Over Voltage Protection (OVP)	38
3.4.8.3 Over Temperature Protection (OTP)	38
3.5 Cold Redundancy Support	38
3.5.1 Powering on Cold Standby supplies to maintain best efficiency	39
3.5.2 Powering on Cold Standby Supplies during a Fault or Over Current Condition	39
3.5.3 BMC Requirements	39
3.5.4 Power Supply Turn On Function	39
3.6 Closed Loop System Throttling (CLST)	40
3.7 Smart Ride Through (SmaRT)	40
3.8 Server Board Power Connectors	40
3.8.1 Power Supply Module Card Edge Connector	40
3.8.2 Hot Swap Backplane Power Connector	41
3.8.3 Optical Drive and SSD Power Connector	41
4. Thermal Management	42
4.1 Thermal Operation and Configuration Requirements	43
4.2 Thermal Management Overview	44
4.2.1 Fan Speed Control	45
4.2.1.1 Programmable Fan PWM Offset	45
4.2.1.2 Fan Redundancy Detection	45
4.2.1.3 Fan Domains	46
4.2.1.4 Nominal Fan Speed	46
4.2.1.5 Thermal and Acoustic Management	46
4.2.1.6 Thermal Sensor Input to Fan Speed Control	47
4.3 System Fans	48
4.4 Power Supply Module Fans	50
4.5 FRUSDR Utility	50
5. System Storage and Peripheral Drive Bay Overview	52
5.1 Front Mount Drive Support	52
5.2 Storage Device Trays	53
5.3 Peripheral Power Sources	56
5.4 Optical Drive Support	57
5.5 Storage Backplane Options	58
5.5.1 SGPIO Functionality	59
5.5.2 I2C Functionality	59
5.5.3 8 x 2.5” Drive SAS Backplane	59
5.5.4 8 x 2.5” Drive Combo SAS / PCIe* SFF Backplane Accessory Kit	61
5.5.5 4 x 3.5” Drive Hot-Swap Backplane Overview	66
5.6 Low Profile eUSB SSD Support	67
5.7 SATA DOM Support	68
6. Storage Controller Options Overview	70
6.1 Embedded SATA/SATA RAID Support	70
6.1.1 Staggered Disk Spin-Up	72
6.2 Embedded SATA SW-RAID support	72
6.2.1 Intel® Rapid Storage Technology (RSTe) 4.1	72
6.2.2 Intel® Embedded Server RAID Technology 2 (ESRT2) 1.41	73
6.3 Intel® Integrated RAID Module Support	74
6.3.1 Intel® RAID Maintenance Free Backup Unit (RMFBU) Support	75
7. Front Control Panel and I/O Panel Overview	76
7.1 I/O Panel Features	76
7.2 Control Panel Features	77
8. Intel® Local Control Panel	81
9. PCIe* Riser Card Support	82
10. Intel® I/O Module Support	84
11. Basic and Advanced Server Management Features	85
11.1.1 Dedicated Management Port	86
11.1.2 Embedded Web Server	86
11.1.3 Advanced Management Feature Support (RMM4 Lite)	88
11.1.3.1 Keyboard, Video, Mouse (KVM) Redirection	88
11.1.3.2 Remote Console	89
11.1.3.3 Performance	89
11.1.3.4 Security	90
11.1.3.5 Availability	90
11.1.3.6 Usage	90
11.1.3.7 Force-enter BIOS Setup	90
11.1.3.8 Media Redirection	90
11.1.3.8.1 Availability	91
11.1.3.8.2 Network Port Usage	91
Appendix A: Integration and Usage Tips	92
Appendix B: POST Code Diagnostic LED Decoder	93
Appendix C: POST Code Errors	96
Appendix D: System Configuration Table for Thermal Compatibility	103
Appendix E: System Cable Routing Diagrams	108
Glossary	110

Intel R2000WT Technical Product Specification - Page 44

Thermal Management Overview

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