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Intel® Xeon Phi™ Coprocessor Card – System Configuration Requirements

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Intel® Server System R2000WT Product Family TPS Figure 38. Shipping Bracket Placement The shipping bracket can be used with both the standard air duct and the air duct included in Intel Accessory kit AWTCOPRODUCT With no shipping bracket installed, the air duct has support for the addition of up to two SSD Storage devices mounted to the air duct via fastener screws. Mounting standard hard disk drives to the air duct is NOT a supported configuration. Mounting hard disk drives to the CPU air duct may cause data loss, performance degradation, and premature drive failures. High power add-in cards that require up to 300W can be supported. A total system power budget should be calculated to determine if the power draw of the desired system configuration meets the power limits of the installed power supplies. A power budget tool for the specified system can be downloaded from http://www.intel.com/support. The latest posted system software updates must be installed on the system to ensure proper fan speed control is enabled. The latest system update package can be downloaded from the following Intel web site: http://downloadcenter.intel.com 5.2 Intel® Xeon Phi™ Coprocessor Card - System Configuration Requirements For best system performance and proper fan speed control, ensure the system is configured as follows: • The following BIOS Setup Utility Options must be set:  MMIO over 4GB = Enabled  MMIO Size = 256GB Intel highly recommends that the latest available system software be installed. The latest system update package can be downloaded from the following Intel web site: http://downloadcenter.intel.com 52 Revision 1.0

Section	Page
1. Introduction	13
1.1 Chapter Outline	13
1.2 Server Board Use Disclaimer	14
1.3 Product Errata	14
2. Product Family Overview	15
2.1 System Features Overview	18
2.2 Server Board Features Overview	20
2.3 Back Panel Features	23
2.4 Front Control Panel Options	23
2.5 Front Drive Bay Options	24
2.6 Locking Front Bezel	25
2.7 System Dimensional Data	27
2.7.1 Chassis Dimensions	27
2.7.2 Label Emboss Dimensions	28
2.7.3 Pull-out Tab Label Emboss Dimensions	29
2.8 System Cable Routing Channels	30
2.9 Available Rack and Cabinet Mounting Kit Options	31
2.10 System Level Environmental Limits	32
3. System Power	33
3.1 Power Supply Configurations	33
3.2 Power Supply Module Options	34
3.2.1 Power Supply Module Efficiency	34
3.2.2 Power Supply Module Mechanical Overview	35
3.2.3 Power Cord Specification Requirements	37
3.3 AC Power Supply Input Specifications	38
3.3.1 Power Factor	38
3.3.2 AC Input Voltage Specification	38
3.3.3 AC Line Isolation Requirements	38
3.3.4 AC Line Dropout / Holdup	39
3.3.4.1 AC Line 12VSBHoldup	39
3.3.5 AC Line Fuse	39
3.3.6 AC Inrush	39
3.3.7 AC Line Transient Specification	39
3.3.8 Susceptibility Requirements	40
3.3.9 Electrostatic Discharge Susceptibility	40
3.3.10 Fast Transient/Burst	40
3.3.11 Radiated Immunity	40
3.3.12 Surge Immunity	40
3.3.13 Power Recovery	41
3.3.14 Voltage Interruptions	41
3.3.15 Protection Circuits	41
3.3.15.1 Over-current Protection (OCP)	41
3.3.15.2 Over-voltage Protection (OVP)	41
3.3.15.3 Over-temperature Protection (OTP)	42
3.3.16 Power Supply Status LED	42
3.4 DC Power Supply Input Specifications	43
3.4.1 DC Input Voltage	43
3.4.2 DC Input Fuse	43
3.4.3 DC Inrush Current	43
3.4.4 DC Input Under Voltage	43
3.4.5 DC Holdup Time and Dropout	43
3.4.6 DC Line Surge Voltages (Line Transients)	44
3.4.7 Susceptibility Requirements	44
3.4.7.1 Electrostatic Discharge Susceptibility	44
3.4.7.2 Fast Transient/Burst	44
3.4.7.3 Radiated Immunity	44
3.4.7.4 Surge Immunity	45
3.4.8 Protection Circuits	45
3.4.8.1 Current Limit (OCP)	45
3.4.8.2 Over Voltage Protection (OVP)	45
3.4.8.3 Over Temperature Protection (OTP)	45
3.5 Cold Redundancy Support	46
3.5.1 Powering on Cold Standby supplies to maintain best efficiency	46
3.5.2 Powering on Cold Standby supplies during a fault or over current condition	47
3.5.3 BMC Requirements	47
3.5.4 Power Supply Turn On Function	47
3.6 Closed Loop System Throttling (CLST)	47
3.7 Smart Ride Through (SmaRT)	47
3.8 Server Board Power Connectors	48
3.8.1 Power Supply Module Card Edge Connector	48
3.8.2 Optional 12V Power Connectors for High Power Add-in Cards	48
3.8.3 Hot Swap Backplane Power Connector	49
3.8.4 Peripheral Power Connector	49
4. Thermal Management	50
4.1 Thermal Operation and Configuration Requirements	52
4.2 Thermal Management Overview	53
4.2.1 Fan Speed Control	54
4.2.1.1 Programmable Fan PWM Offset	55
4.2.1.2 Hot-Swap Fans	55
4.2.1.3 Fan Redundancy Detection	55
4.2.1.4 Fan Domains	55
4.2.1.5 Nominal Fan Speed	56
4.2.1.6 Thermal and Acoustic Management	56
4.2.1.7 Thermal Sensor Input to Fan Speed Control	56
4.3 System Fans	58
4.4 Power Supply Module Fans	59
4.5 FRUSDR Utility	60
5. Intel® Xeon Phi™ Coprocessor and GPGPU Add-in Card Support	61
5.1 Support Criteria	61
5.2 Intel® Xeon Phi™ Coprocessor Card – System Configuration Requirements	64
6. System Storage and Peripheral Drive Bay Overview	65
6.1 Front Mount – Drive Bay Support	65
6.2 Hot Swap Storage Device Trays	67
6.3 Peripheral Power Sources	69
6.4 Optical Drive Support	70
6.5 Storage Backplane Options	71
6.5.1 SGPIO Functionality	72
6.5.2 I2C Functionality	72
6.5.3 8 x 2.5” Drive Single Port SAS Backplane	73
6.5.4 8 x 2.5” Drive Dual Port SAS Backplane	75
6.5.5 8 x 2.5” Drive Combo SAS / PCIe* SFF Backplane Accessory Kit	77
6.5.6 3.5” Drive Hot-Swap Backplane Overview	84
6.6 2 x 2.5” Hot Swap Drive Bay Accessory Kit	86
6.7 Internal – Fixed Mount Solid State Drive (SSD) Support	89
6.8 Low Profile eUSB SSD Support	90
6.9 SATA DOM Support	90
7. Storage Controller Options Overview	92
7.1 Embedded SATA / SATA RAID support	92
7.1.1 Staggered Disk Spin-Up	94
7.2 Embedded SATA SW-RAID support	94
7.2.1 Intel® Rapid Storage Technology (RSTe) 4.1	94
7.2.2 Intel® Embedded Server RAID Technology 2 (ESRT2) 1.41	95
7.3 Intel® Integrated RAID Module Support	97
7.3.1 Intel® RAID Maintenance Free Backup Unit (AXXRMFBUx) Support	97
7.4 Intel® RAID Expander Card Support	99
7.4.1 36-Port PCIe Intel® RAID Expander Card RES3FV288	100
7.4.2 36-Port Internal Intel® RAID Expander Card RES3TV360	101
8. Front Control Panel and I/O Panel Overview	102
8.1 I/O Panel Features	102
8.2 Control Panel Features	103
9. Intel® Local Control Panel	107
10. PCIe* Riser Card Support	108
Riser Card Assembly	109
10.1 Riser Slot #1 and Riser Slot #2 Riser Card Options	111
10.1.1 3-Slot PCIe Riser Card – Intel Product Code: A2UL8RIS2BB	111
10.1.2 2-Slot PCIe Riser Card – Intel Product Code: A2UL16RIS2BB	111
10.2 Riser Slot #3 Riser Card Option	112
11. Intel® I/O Module Support	113
12. Basic and Advanced Server Management Features	114
12.1.1 Dedicated Management Port	115
12.1.2 Embedded Web Server	115
12.1.3 Advanced Management Feature Support (RMM4 Lite)	117
12.1.3.1 Keyboard, Video, Mouse (KVM) Redirection	117
12.1.3.2 Remote Console	118
12.1.3.3 Performance	118
12.1.3.4 Security	119
12.1.3.5 Availability	119
12.1.3.6 Usage	119
12.1.3.7 Force-enter BIOS Setup	119
12.1.3.8 Media Redirection	119
12.1.3.8.1 Availability	120
12.1.3.8.2 Network Port Usage	120
Appendix A: Integration and Usage Tips	121
Appendix B: POST Code Diagnostic LED Decoder	122
Appendix C: POST Code Errors	127
Appendix D: System Configuration Table for Thermal Compatibility	134
Appendix E: System Cable Routing Diagrams	148
Glossary	153

Match case Limit results 1 per page

Intel

Server System R2000WT Product Family TPS

Revision 1.0

Figure 38. Shipping Bracket Placement

The shipping bracket can be used with both the standard air duct and the air duct included in Intel Accessory

kit AWTCOPRODUCT

With no shipping bracket installed, the air duct has support for the addition of up to two SSD Storage

devices mounted to the air duct via fastener screws.

Mounting standard hard disk drives to the air duct is

NOT a supported configuration.

Mounting hard disk drives to the CPU air duct may cause data loss,

performance degradation, and premature drive failures.

High power add-in cards that require up to 300W can be supported. A total system power budget should be

calculated to determine if the power draw of the desired system configuration meets the power limits of the

installed power supplies.

A power budget tool for the specified system can be downloaded from

http://www.intel.com/support

The latest posted system software updates must be installed on the system to ensure proper fan speed

control is enabled. The latest system update package can be downloaded from the following Intel web site:

http://downloadcenter.intel.com

5.2

Intel

Xeon Phi™ Coprocessor Card – System Configuration Requirements

For best system performance and proper fan speed control, ensure the system is configured as follows:

•

The following <F2> BIOS Setup Utility Options must be set:



MMIO over 4GB = Enabled



MMIO Size = 256GB

Intel highly recommends that the latest available system software be installed. The latest system update

package can be downloaded from the following Intel web site: http://downloadcenter.intel.com