Intel S2400SC Technical Product Specification - Page 121

Intel® Server Board S2400SC TPS Environmental Limits Specification 11. Environmental Limits Specification The following table defines the Intel® Server Board S2400SC operating and non-operating environmental limits. Operation of the Intel® Server Board S2400SC at conditions beyond those shown in the following table may cause permanent damage to the system. Exposure to absolute maximum rating conditions for extended periods may affect system reliability. Table 48. Server Board Design Specifications Operating Temperature 0º C to 55º C 1 (32º F to 131º F) Non-Operating Temperature -40º C to 70º C (-40º F to 158º F) DC Voltage ± 5% of all nominal voltages Shock (Unpackaged) Trapezoidal, 35g, 170 inches/sec Shock (Packaged) < 20 pounds 36 inches 20 to < 40 pounds 30 inches 40 to < 80 pounds 24 inches 80 to < 100 pounds 18 inches 100 to < 120 pounds 12 inches 120 pounds 9 inches Vibration (Unpackaged) 5 Hz to 500 Hz 3.13 g RMS random Note: 1. Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel® server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel® developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible, if components fail or the server board does not operate correctly when used outside any of its published operating or non-operating limits. Disclaimer Note: Intel® ensures the unpackaged server board and system meet the shock requirement mentioned above through its own chassis development and system configuration. It is the responsibility of the system integrator to determine the proper shock level of the board and system if the system integrator chooses different system configuration or different chassis. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of its published operating or non-operating limits. 11.1 Processor Thermal Design Power (TDP) Support To allow optimal operation and long-term reliability of Intel processor-based systems, the processor must remain within the defined minimum and maximum case temperature (TCASE) specifications. Thermal solutions not designed to provide sufficient thermal capability may affect the long-term reliability of the processor and system. The server board is designed to support the Intel® Xeon® Processor E5-2400 product family TDP guidelines up to and including 95W. Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel® ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel developed server Revision 1.1 111 Intel order number G36516-001