Intel S5500WB12V Product Specification - Page 95

Unified Retention System Support

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Intel® Server Board S5500WB TPS Design and Environmental Specifications Note: The Intel® Thermal Solution STS100P - Passive 1U/2U heatsink was tested for processors up to and including 95-W TDP (Thermal Design Power). Product order code: BXSTS100P 9.3.1 Unified Retention System Support The server board complies with the Intel® Unified Retention System (URS) and the Unified Backplate Assembly. The server board ships with a made-up assembly of Independent Loading Mechanism (ILM) and Unified Backplate at each processor socket. The URS retention transfers load to the server board via the unified backplate assembly. The URS spring, captive in the heatsink, provides the necessary compressive load for the thermal interface material. All components of the URS heatsink solution are captive to the heatsink and only require a Philips* screwdriver to attach to the unified backplate assembly. See the following figure for the stacking order of the URS components. The ILM and unified backplate are removable, allowing for the use of non-Intel heatsink retention solutions. Figure 31. Unified Retention System and Unified Backplate Assembly Revision 1.9 81 Intel order number E53971-008

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Intel® Server Board S5500WB TPS
Design and Environmental Specifications
Revision 1.9
Intel order number E53971-008
81
Note:
The Intel
®
Thermal Solution STS100P
–
Passive 1U/2U heatsink was tested for
processors up to and including 95-W TDP (Thermal Design Power). Product order code:
BXSTS100P
9.3.1
Unified Retention System Support
The server board complies with the Intel
®
Unified Retention System (URS) and the Unified
Backplate Assembly. The server board ships with a made-up assembly of Independent Loading
Mechanism (ILM) and Unified Backplate at each processor socket.
The URS retention transfers load to the server board via the unified backplate assembly. The
URS spring, captive in the heatsink, provides the necessary compressive load for the thermal
interface material. All components of the URS heatsink solution are captive to the heatsink and
only require a Philips* screwdriver to attach to the unified backplate assembly. See the
following figure for the stacking order of the URS components.
The ILM and unified backplate are removable, allowing for the use of non-Intel heatsink
retention solutions.
Figure 31. Unified Retention System and Unified Backplate Assembly