Intel SR1500 SR1500 Chassis TPS - Page 27

Cooling Sub-System

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Intel® Server System SR1500AL TPS 3. Cooling Sub-System Cooling Sub-System The cooling sub-system is compromised of five 40x40x56mm dual rotor fans, two 40x40x28mm power supply fans, a CPU air duct, and a PS / Electronics Bay Isolation Air Baffle. These components are used to provide the necessary cooling and airflow to the system. A fan on the processor heat sink is not necessary in this chassis. In order to maintain the necessary airflow within the system, the air baffle, CPU air duct, and the top cover need to be properly installed. Note: The Intel® Server Chassis SR1500 does not support redundant cooling. Should a fan fail, the system should be powered down as soon as possible to replace the failed fan. 3.1 Five-Fan Module A fan assembly consisting of five 40x40x56mm dual rotor multi-speed fans provides the primary airflow for the system. Four of the dual rotor fans provide the primary cooling for the processors, memory, second and third hard drive bays, and components in the low profile PCI zone. The fifth dual rotor fan provides the primary cooling for the components in the full height PCI zone. Removal and insertion of the fans and fan module is tool-less and provides for ease of installation and serviceability. Fans are individually replaceable through a connection to the hotswap backplane. Neither the fan assembly nor the individual fans within it are hot-swappable. The server must be turned off before any of the fans can be replaced. Each dual rotor fan has a 10-pin wire harness which connects to the hot-swap backplane. Each fan harness provides power and tachometer lines allowing the fans to be monitored independently by Intel® System Management Software. TP02164 Figure 13. Fan Module Assembly Table 12 Non-redundant Cooling Zones Fan System Fan #1/2 System Fan #3/4 System Fan #5 Power Supply Fans 2 fans per module Cooling Zone CPU1 CPU2 PCI Power Supply Description of greatest cooling influence Primary cooling for CPU1 and memory Primary cooling for hard drive2, CPU2, the MCH, and the low profile PCI cards Primary cooling for hard drive1, Full Height PCI cards, PXH and IOP80333 chipset Primary cooling for hard drive 0, and the power supply module Revision 1.4 15 Intel order number D31981-008

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Intel® Server System SR1500AL TPS
Cooling Sub-System
Revision 1.4
Intel order number D31981-008
15
3.
Cooling Sub-System
The cooling sub-system is compromised of five 40x40x56mm dual rotor fans, two 40x40x28mm
power supply fans, a CPU air duct, and a PS / Electronics Bay Isolation Air Baffle. These
components are used to provide the necessary cooling and airflow to the system.
A fan on the
processor heat sink is not necessary in this chassis.
In order to maintain the necessary airflow within the system, the air baffle, CPU air duct, and the
top cover need to be properly installed.
Note:
The Intel
®
Server Chassis SR1500 does not support redundant cooling. Should a fan fail,
the system should be powered down as soon as possible to replace the failed fan.
3.1
Five-Fan Module
A fan assembly consisting of five 40x40x56mm dual rotor multi-speed fans provides the primary
airflow for the system.
Four of the dual rotor fans provide the primary cooling for the processors,
memory, second and third hard drive bays, and components in the low profile PCI zone. The
fifth dual rotor fan provides the primary cooling for the components in the full height PCI zone.
Removal and insertion of the fans and fan module is tool-less and provides for ease of
installation and serviceability.
Fans are individually replaceable through a connection to the hot-
swap backplane.
Neither the fan assembly nor the individual fans within it are hot-swappable.
The server must be turned off before any of the fans can be replaced.
Each dual rotor fan has a 10-pin wire harness which connects to the hot-swap backplane. Each
fan harness provides power and tachometer lines allowing the fans to be monitored
independently by Intel
®
System Management Software.
TP02164
Figure 13. Fan Module Assembly
Table 12
Non-redundant Cooling Zones
Fan
Cooling
Zone
Description of greatest cooling influence
System Fan #1/2
CPU1
Primary cooling for CPU1 and memory
System Fan #3/4
CPU2
Primary cooling for hard drive2, CPU2, the MCH,
and the low profile PCI cards
System Fan #5
PCI
Primary cooling for hard drive1, Full Height PCI
cards, PXH and IOP80333 chipset
Power Supply
Fans 2 fans per
module
Power
Supply
Primary cooling for
hard drive 0, and the power
supply module