Intel TIGH2U Product Brief - Page 4

Embedded Intel® Architecture in Networking and Communications: intel.com/netcomms/

∆

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families.

See http://www.intel.com/products/processor_number for details.

1

Quad-Core Intel

®

Xeon

®

processor 5300 series. Up to 38% (1.38x) higher Perf/WattE5450 vs E5335 – Published/measured results on SPECjbb2005* – Oct 2, 2007.

2

Dual-Core Intel

®

Xeon

®

processor 5100 series. Up to 119% (2.19x) higher Performance X5460 vs 5160 – Published/measured results on SPECjbb2005* – Oct 2, 2007.

3

Single-Core 64-bit Intel

®

Xeon

®

processor 3.80 GHz. Up to 443% (5.43x) higher Performance X5460 vs Xeon 3.80 – Published/measured results on SPECint*_rate_base2006 – Oct 2, 2007.

4

Intel

®

Virtualization Technology requires a computer system with an enabled Intel

®

processor, BIOS, virtual machine monitor (VMM) and, for some uses, certain platform software enabled for it. Functionality,

performance or other benefits will vary depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check

with your application vendor.

5

Intel

®

I/O Acceleration Technology (Intel

®

I/OAT) requires an operating system that supports Intel I/OAT.

6

64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel

®

64 architecture. Performance will vary

depending on your hardware and software configurations. Consult with your system vendor for more information.

7

As per 25-GS0009 Boards and Systems Environmental Governing Specification.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL

®

PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL

PROPERTYRIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A

PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL,

THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR

DEATH MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features

or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising

from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document

may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on

request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an

order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel’s Web Site http://www.intel.com/.

*Other names and brands may be claimed as the property of others.

Copyright © 2008 Intel Corporation. All rights reserved.

Intel, the Intel logo, Intel. Leap ahead., Intel. Leap ahead. logo, Xeon, and Intel Core are trademarks of Intel Corporation in the U.S. and other countries.

Printed in USA

0108/KSC/OCG/XX/PDF

Please Recycle

318820-002US

Specifications

Processor

Type

Two (2) Quad-Core Intel® Xeon® processors 5400

∆

series

with 12 MB cache

Front-side bus

1333 MHz

Chipset

Memory Controller Hub

Intel® 5000P Memory Controller Hub (MCH)

I/O Controller Hub

Intel® 6321ESB I/O Controller Hub (ICH)

Connections

Two (2) PCI risers

supporting up to

five PCI slots (included)

• One (1) low-profile riser supporting two PCIe x4 slots

• One (1) full-height, full-length riser supporting three

slots (two PCIe x4 [or one PCIe x8] and one PCI-X)

Additional full-height

riser configuration

(optional)

• PCI-X (active): Three (3) independent PCI-X slots

(133 MHz max)

• PCI-X (passive): Two (2) PCI-X slots (100 MHz max)

and one PCI-X slot (66 MHz) on shared bus

GbE NIC (CU) ports

• Two (2) on base board (rear)

• Two (2) via optional I/O Module (rear, optional)

USB 2.0 ports

• Three (3): One front/two rear

Storage

Type

SAS 2.5-inch hot-swap HDD

Redundancy

RAID 1 and RAID 5

Internal

Carrier with six HDD trays

External

SAS port on rear supports JBOD

Environmental

Temperature, operating

+5° C to +40° C (41° F to 104° F)

Temperature, short-term

operating (<96 hrs)

-5° C to 50° C

Temperature, non-

operating

-40° C to 70° C (-40° F to 158° F)

Altitude

0 to 1,800 m (0 to 5,905 ft) @ 40° C

0 to 4,000 m (0 to 13,123 ft) @ 30° C

Humidity, operating

5% to 85%

Humidity, short-term

operating

5% to 90%

Humidity, non-operating

93%, non-condensing at temperatures of 23° C (73° F)

to 40° C (104° F)

Vibration, operating

Swept sine survey at an acceleration amplitude of

0.1 G from 5 to 100 Hz and back to 5 Hz at a rate of

0.1 octave/minute; 90 minutes per axis on all three

axes as per Bellcore GR-63-CORE standards

Vibration, non-operating

Swept sine survey at an acceleration amplitude of 0.5

G from 5 to 50 Hz at a rate of 0.1 octaves/ minute, and

an acceleration amplitude of 3.0 G from 50 to 500 Hz at

a rate of 0.25 octaves/minute, on all three axes as per

Bellcore GR-63-CORE standard. 2.2 Grms, 10 minutes

per axis on all three axes

Shock, operating

Half-sine 2 G, 11 ms pulse, 100 pulses in each direction,

on each of the three axes

7

Environmental, continued

Shock, non-operating

Trapezoidal, 25 G, 170 inches/sec delta V, three drops in

each direction, on each of the three axes

4

Acoustic

Sound pressure: < 55 dBA at ambient temperatures

< 24° C measured at bystander positions in operating

mode

Memory

Maximum memory

capacity

32 GB (non-mirrored mode)

DIMM slots

Eight (8)

Memory type

FB-DIMM technology at 533 and 667 MHz

Physical

Height

3.45 inches (87.6 mm)

Width

17.14 inches (435.3 mm)

Depth

20 inches (508 mm)

Regulatory Compliance

Safety

UL 60950-1, 1st Edition/CSA 22.2 60950-1, Low Voltage

Directive 2006/95/EC, GS to EN60950-1, 1st Edition CB

Certificate and Report to IEC60950-1, 1st Edition and all

international deviations

Electromagnetic

Compatibility:

Australia/New Zealand

C-tick, Class A

Canada

ICES-003, Issue 4, Class A Limit

China

CCC Approval, Class A (EMC and Safety)

Europe

EMC Directive, 2004/108/EC

EN55022, Class A Limit, Radiated and

Conducted Emissions

EN55024 Immunity Characteristics for ITE

EN61000-4-2 ESD Immunity

EN61000-4-3 Radiated Immunity

EN61000-4-4 Electrical Fast Transient

EN61000-4-5 Surge

EN61000-4-6 Conducted RF

EN61000-4-8 Power Frequency Magnetic Fields

EN61000-4-11 Voltage Fluctuations and Short

Interrupts

EN61000-3-2 Harmonic Currents

EN61000-3-3 Voltage Flicker

International

CISPR 22, Class A Limit, CISPR 24 Immunity

Japan

VCCI Class A

Korea

RRL Approval, Class A

Russia

Gost Approval

Taiwan

BSMI Approval, CNS 13438, Class A and CNS13436 Safety

USA

FCC 47 CFR Parts 2 and 15, Verified Class A Limit

Intel TIGH2U Product Brief - Page 4

Specifications

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