Lantronix Open-Q 660 SOM Intelligent Edge Solution by Lantronixr Product Catal - Page 15

Intelligent Edge Solutions Services Product Development In addition to our ready for production embedded computing solutions, Lantronix has an experienced multidisciplinary engineering team that can complete all aspects of IoT product development, including: mechanical and RF design, electrical engineering, BSP and driver development, middleware and applications, rapid prototyping, certification, and mass production. Our comprehensive capabilities allow you to engage with one company to build your product from concept through production; avoiding the challenges and finger pointing that can occur when working with multiple vendors. Software Engineering Intrinsyc's software engineering team works with our technology partners at the earliest stages of new chip introduction, giving us valuable early access and knowledge of the newest high-performance technology. Our team is very experienced with embedded systems software having created countless board support packages and drivers for Android, Linux, Windows and QNX. Our driver experience includes power optimizations, radios (CDMA, GSM/GPRS, Wi-Fi, GPS, Bluetooth), FPGAs and various peripherals including USB, LCD, Touch, Camera, e-Ink, codecs and more. Hardware Engineering In addition to designing and developing our proprietary advanced development kits, hardware reference designs and high volume production system-on-modules (SOM), Intrinsyc's hardware engineering team develops custom embedded computing modules and peripheral boards tailored to our client's specifications. Mechanical Engineering Intrinsyc Technologies' mechanical engineering team has extensive experience in the development and commercialization of mobile and IoT products. This design experience spans a breadth of product types, with a variety of thermal and structural engineering challenges, high density device packaging, as well as design for ruggedized products. The mechanical design and manufacturing experience can support proof of concept/prototype projects and low to high volume fabrication and production processes.