Lantronix Open-Q 845 SOM Development Kit Open-Qtm 845 uSOM Development Kit Qui - Page 1

Lantronix Open-Q 845 SOM Development Kit Manual

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Open-Q™ 845 µSOM Development Kit Quick Start Guide Package Contents 1. Open-Q™ 845 µSOM with Qualcomm® SDA845 SoC 2. Open-Q™ 845 µSOM Carrier Board 3. AC Power Adapter 4. LCD/Touchpanel (Optional) 1 2 3 4 8 9 10 11 12 1. 12V DC power jack 2. Power source switch (DC/Batt) 3. Battery connector 4. USB 3.0 Type-A Connector 5. Power button 6. Volume + button 7. Volume - button 8. Audio Headset Jack 9. Haptic Output Header 10. USB 3.0 Type-C connector 11. USB debug UART Micro B 12. WLAN/BT Channel 0 Antenna (PCB trace) 13. Audio I/O expansion header 14. MIPI Camera 3 Connector 15. Coin Cell Battery Holder 16. Power Header 17. Flash 2 Connector 18. MIPI Camera 2 Connector 19. Flash 1 Connector 20. MIPI Camera 1 Connector 21. MIPI Camera 4 Connector 22. System configuration switches 23. Sensor expansion header 32 24. SOM current sense header 25. Micro SD socket* 26. Open-Q™ LCD Touch Panel (optional) 27. WLAN Channel 1 Antenna (PCB trace) 28. Digital I/O connector 29. Mini-PCIe Card Connector* 30. Mini-PCIe SIM Card socket* 31 31. Audio Output expansion header 32. Audio Input expansion header 30 33. WLAN/BT Channel 0 U.FL Antenna Connector 29 34. WLAN Channel 1 U.FL Antenna Connector 35. SDA845 28 36. Open-Q 845 System on Module (SOM) * On Bottom side 5 13 6 14 7 15 16 33 17 34 35 18 36 19 20 Specifications are subject to change - 895-0014-00 Rev A 27 26 25 24 23 22 21 Your use of this document is subject to and governed by those terms and conditions, https://www.intrinsyc.com/legal-terms/qualcomm-terms.html, in the Intrinsyc Purchase and Software License Agreement for the Open-Q™ 845 Development Kit based on the Qualcomm® SDA845 SoC, which you or the legal entity you represent, as the case may be, accepted and agreed to when purchasing an Open-Q™ 845 Development Kit from Intrinsyc Technologies Corporation ("Agreement"). You may use this document, which shall be considered part of the defined term "Documentation" for purposes of the Agreement, solely in support of your permitted use of the Open-Q™ 845 Development Kit under the Agreement. Distribution of this document is strictly prohibited without the express written permission of Intrinsyc Technologies Corporation and its respective licensors, which they can withhold, condition or delay in its sole discretion. Lantronix is a registered trademark of Lantronix, Inc. in the United States and other countries. Intrinsyc is a trademark of Intrinsyc Technologies Corporation, registered in Canada and other countries. Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. Other product and brand names used herein may be trademarks or registered trademarks of their respective owners. Qualcomm SDA845 is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.

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Open
-
Q
845 µSOM Development Kit
Quick Start Guide
Your use of this document is subject to and governed by those terms and conditions,
, in the Intrinsyc Purchase and Software License Agreement for the Open-
Q™ 845 Development Kit based on the
Qualcomm® SDA845 So
C,
which you or the legal entity you represent, as the case may be, accepted and agreed to when purchasing an Open-
Q™ 845 Development Kit from Intrinsyc Technologies Corporation (“Agreement”). You may use this document, which shall be considered part of th
e d
efined term “Documentation”
for purposes of the Agreement, solely in support of your permitted use of the Open-
Q™ 845 Development Kit under the Agreement. D
istribution of this document is strictly prohibited without the express written permission of Intrinsyc Technologies Corporation and its respective licensors,
which they can withhold, condition or delay in its sole discretion.
Lantronix is a registered trademark of Lantronix, Inc. in the United States and other countries. Intrinsyc is a trademark of Intrinsyc Technologies Corporation, registered in Canada and other countries. Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other
countries.
Other product and brand names used herein may be trademarks or registered trademarks of their respective owners.
Qualcomm SDA845 is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.
Package Contents
1.
Open
-
Q™ 845 µSOM with Qualcomm® SDA845 SoC
2.
Open
-
Q™ 845 µSOM Carrier Board
3.
AC Power Adapter
4.
LCD/Touchpanel (Op°onal)
1.
12V DC power jack
2.
Power source switch (DC/Ba±)
3.
Ba±ery connector
4.
USB 3.0 Type
-
A Connector
5.
Power bu±on
6.
Volume + bu±on
7.
Volume
-
bu±on
8.
Audio Headset Jack
9.
Hap°c Output Header
10.
USB 3.0 Type
-
C connector
11.
USB debug UART Micro B
12.
WLAN/BT Channel 0 Antenna (PCB
trace)
13.
Audio I/O expansion header
14.
MIPI Camera 3 Connector
15.
Coin Cell Ba±ery
Holder
16.
Power Header
17.
Flash 2 Connector
18.
MIPI Camera 2 Connector
19.
Flash 1 Connector
20.
MIPI Camera 1 Connector
21.
MIPI Camera 4 Connector
22.
System configura°on switches
23.
Sensor expansion header
24.
SOM current sense header
25.
Micro SD socket*
26.
Open
-
Q™ LCD Touch Panel (op°onal)
27.
WLAN Channel 1 Antenna (PCB trace)
28.
Digital I/O connector
29.
Mini
-
PCIe Card Connector*
30.
Mini
-
PCIe SIM Card socket*
31.
Audio Output expansion header
32.
Audio Input expansion header
33.
WLAN/BT Channel 0 U.FL Antenna
Connector
34.
WLAN Channel 1 U.FL Antenna Con-
nector
35.
SDA845
36.
Open
-
Q 845 System on Module
(SOM)
* On Bo±om side
4
1
2
Specifications are subject to change
-
895-0014-00 Rev A
13
22
10
11
9
20
18
12
34
21
26
25
28
31
32
14
19
3
33
23
27
29
30
36
8
15
17
16
24
5
35
6
7