Lantronix xPico 270 80211ac Wi-Fi Bluetooth Embedded IoT Gateway A4 - Page 1

Lantronix Embedded Networking Modules lantronix.com Features Category Mounting Option Operating System 10/100 Ethernet Wireless 802.11 Bluetooth®/ Bluetooth Low Energy Antenna Options LAN > 802.11 Bridging Simultaneous Soft AP and Client XPort® EDGE Wired Device Server Connector ThreadX • xPico® 270 xPico® 250 xPico® 240 Now Available Connector/SMT ThreadX External RJ45 Jack/Magnetic Module/PHY a/b/g/n/ac Connector/SMT ThreadX External RJ45 Jack/Magnetic Module/PHY a/b/g/n Wireless IoT Gateway Connector/SMT ThreadX External RJ45 Jack/Magnetic Module/PHY a/b/g/n 5.0 External • • 5.0 External • • On Module or External‡ • • PremierWave® 2050 Connector/SMT‡ Linux External RJ45 Jack/Magnetic Module a/b/g/n/ac 4.2 On Module or External‡ • • Enterprise Wi-Fi Security SmartRoam™ TCP / UDP Client-Server Telnet DHCP, BOOTP & AUTOIP FIPS 140-2 Level 1 SFTP SNMP Modbus (*Available in IAP) Web Server - HTTP/CGI (*Custom) Web Server - AJAX SSL Secure Web Server SSL Secure Data Tunneling SSH Client & Server IPv6 (*Linux SDK Development Platform) AES Encryption Max Configurable GPIO Pins (*RTS/CTS on Configurable Pins) Software Development Kit Flash/RAM • • •† v1/v2 • • 3* • 8MB/2MB • • • • •† v1/v2 •† • 12 • 8MB/2MB • • • • •† v1/v2 •† • 12 • 8MB/2MB • • • • •† v1/v2 •† • 12 • 8MB/2MB • v1/v2/v3 13 •* (Yocto) 256MB/128MB Maximum Serial Data Rate Web Manager (for Configuration) Email Client (*Subject Line Only) Operating Temperature (C°/F°) Dimensions (mm; +/-0.3mm) 4 Mbps • • -40 to 85°C / -40 to 185°F 33.9 x 16.25 x 13.5 4 Mbps • • -40 to 85°C / -40 to 185°F 17 x 25 x 2 (LGA) 22 x 33.5 x 2.73 (Edge Card) 4 Mbps • • -40 to 85°C / -40 to 185°F 17 x 25 x 2 (LGA) 22 x 33.5 x 2.73 (Edge Card) 4 Mbps • • -40 to 85°C / -40 to 185°F 17 x 25 x 2 (LGA) 22 x 33.5 x 2.73 (Edge Card) 921 Kbps • • -40 to 85°C / -40 to 185°F 46.66 x 45.07 x 3.5 SPI Interface USB (*Full Speed Only) † Available in future software release ‡ Version dependent • Device & Host • Device & Host • Device & Host Lantronix Corporate Headquarters 7535 Irvine Center Dr., S. 100, Irvine CA 92618 t: 800.422.7055 s ales@lantron ix.com EMEA Sales t:+31 (0)76 52 36 744 [email protected] Asia/Pacific Sales t: + 852 3955 0218 [email protected] India Sales t:+91 994 551 2488 [email protected] © 2020 Lantronix, Inc. All rights reserved. Lantronix, xPico, XPort and PremierWave are registered trademarks of Lantronix Inc. in the U.S. and certain other countries. Evolution OS, Connect Smart. Do More., and SmartRoam are registered trademarks or trademarks of Lantronix Inc. Wi-Fi® is a registered trademark of Wi-Fi® Alliance. The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG,Inc. and any use of such marks by Lantronix is under license. All other trademarks are the property of their respective owners. Specifications subject to change without notice. MPM-00001 Rev E • Device & Host xPico Wi-Fi® Wireless Module Connector/SMT‡ ThreadX b/g/n On Module or External‡ • •(†UDP) • • • •† • 8 1MB/128KB 921 Kbps • -40 to 85°C / -40 to 185°F SMT (1002): 30.1 x 18.3 x 3.0 SMT (1003): 26.1x18.3x 3.0 24 x 16.5 x 5.64 •† •*