Lantronix xPico Wi-Fi xPico - Integration Guide - Page 33
Mounting Instructions and PCB Footprint, To Access CAD Files
View all Lantronix xPico Wi-Fi manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 33 highlights
3: Mounting Instructions and PCB Footprint 3. Mounting Instructions and PCB Footprint The xPico embedded device server dimensions and mounting instructions are shown in the following drawings below. You may also directly access the CAD files through the Lantronix website. Note: The mounting instructions in this section are applicable to both the xPico and the xPico Wi-Fi embedded device servers though the xPico pictures below are used to demonstrate installation. For temperature environments up to +85° Celsius, it is recommended that the mating PCB have its outer layers flooded with signal ground and a heat pad be placed between the module and mating PCB. The recommended heat pad is Lantronix part number XPC100A002-01-B. The ground flooding and heat pad are only required for xPico Wi-Fi units in environments above +70°C. For environments below +70°C the heat pad and ground flooding are not required. To Access CAD Files 1. Go to http://www.lantronix.com/products/cad-visio.html. 2. Click Download CAD files here to access the Registration Form. Figure 3-1 White Mounting Quick Clip Dimensions xPico® Embedded Device Server Integration Guide 33