Lenovo 2623D3U Hardware Maintenance Manual - Page 117
Protection
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Removing and replacing a FRU Following components soldered on the top side of the system board are extremely sensitive. When you service the system board, avoid any kind of rough handling. a Accelerometer chip for the HDD Active Protection System b Security chip c CPU d Video chip e MCH (Memory Controller Hub) f ICH (I/O Controller Hub) Bending or flexing the system board can cause ball grid array (BGA) connections to crack (unzip). c d e f b a ThinkPad T60 and T60p 111
Following
components
soldered
on
the
top
side
of
the
system
board
are
extremely
sensitive.
When
you
service
the
system
board,
avoid
any
kind
of
rough
handling.
±a²
Accelerometer
chip
for
the
HDD
Active
Protection
System
±b²
Security
chip
±c²
CPU
±d²
Video
chip
±e²
MCH
(Memory
Controller
Hub)
±f²
ICH
(I/O
Controller
Hub)
Bending
or
flexing
the
system
board
can
cause
ball
grid
array
(BGA)
connections
to
crack
(unzip).
a
b
c
d
e
f
Removing
and
replacing
a
FRU
ThinkPad
T60
and
T60p
111