Lenovo ThinkCentre A60 Hardware Maintenance Manual - Page 147
Remove the retention module from the rear of the failing system board
View all Lenovo ThinkCentre A60 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 147 highlights
10. Disconnect the heat sink and fan assembly cable from the system board. See the system board illustration for your machine type at "Identifying parts on the system board" on page 130. 11. Rotate handle 1 to release the heat sink clamp and then disengage the clamp from the plastic retention bracket. 12. Lift the heat sink and fan assembly off the failing system board. Place the heat sink on its side so that the thermal grease does not come in contact with anything. 13. Remove the retention module from the rear of the failing system board and install it in the same position on the new system board. 14. To release the microprocessor 2 from the system board socket, lift the small handle 1 . Chapter 9. Replacing FRUs (tower computers) 141
10.
Disconnect the heat sink and fan assembly cable from the system board. See
the system board illustration for your machine type at “Identifying parts on
the system board” on page 130.
11.
Rotate handle
±1²
to release the heat sink clamp and then disengage the clamp
from the plastic retention bracket.
12.
Lift the heat sink and fan assembly off the failing system board. Place the heat
sink on its side so that the thermal grease does not come in contact with
anything.
13.
Remove the retention module from the rear of the failing system board and
install it in the same position on the new system board.
14.
To release the microprocessor
±2²
from the system board socket, lift the small
handle
±1²
.
Chapter 9. Replacing FRUs (tower computers)
141