Lenovo ThinkPad T60 Hardware Maintenance Manual - Page 121
Protection
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Removing and replacing a FRU Following components soldered on the top side of the system board are extremely sensitive. When you service the system board, avoid any kind of rough handling. a Accelerometer chip for the HDD Active Protection System b Security chip c CPU d Video chip e MCH (Memory Controller Hub) f ICH (I/O Controller Hub) Bending or flexing the system board can cause ball grid array (BGA) connections to crack (unzip). c d e f b a ThinkPad T60 and T60p (14.1-inch and 15.0-inch) 115
Following
components
soldered
on
the
top
side
of
the
system
board
are
extremely
sensitive.
When
you
service
the
system
board,
avoid
any
kind
of
rough
handling.
±a²
Accelerometer
chip
for
the
HDD
Active
Protection
System
±b²
Security
chip
±c²
CPU
±d²
Video
chip
±e²
MCH
(Memory
Controller
Hub)
±f²
ICH
(I/O
Controller
Hub)
Bending
or
flexing
the
system
board
can
cause
ball
grid
array
(BGA)
connections
to
crack
(unzip).
a
b
c
d
e
f
Removing
and
replacing
a
FRU
ThinkPad
T60
and
T60p
(14.1-inch
and
15.0-inch)
115