Samsung ML 1710 Service Manual - Page 9

R E F E R E N C E I N F O R M AT I O N 2.2 Acronyms and Abbreviations The table in the below explains abbreviations used in this service manual. The contents of this service manual are declared with abbreviations in many parts. Please refer to the table. AC Alternating Current ASIC Application Specific Integrated Circuit ASSY assembly BIOS Basic Input Output System CMOS Complementary Metal Oxide Semiconductor CN connector CON connector CPU Central Processing Unit dB decibel dbA decibelampere dBM decibel milliwatt DC direct current DCU Diagnostic Control Unit DPI Dot Per Inch DRAM Dynamic Random Access Memory DVM Digital Voltmeter ECP Enhanced Capability Port EEPROM Electronically Erasable Programmable Read Only Memory EMI Electro Magnetic Interference EP electrophotographic EPP Enhanced Parallel Port F/W firmware GDI graphics device interface GND ground HBP Host Based Printing HDD Hard Disk Drive HV high voltage HVPS High Voltage Power Supply I/F interface I/O Input and Output IC integrated circuit IDE Intelligent Drive electronics or Imbedded Drive Electronics IEEE IPA IPM LAN lb LBP LCD LED LSU MB MHz NVRAM OPC PBA PCL PDL PPM PTL Q-PID Q ty RAM ROM SCF SMPS SPGP SPL Spool SW sync USB Institute of Electrical and Electronics Engineers. Inc Isopropy Alcohol Images Per Minute local area network pound(s) Laser Beam Printer Liquid Crystal Display Light Emitting Diode Laser Scanning Unit megabyte megahertz nonvolatile random access memory Organic Photo Conductor Printed Board Assembly Printer Command Language , Printer Control Language Page Discription Language Page Per Minute Pre-Transfer Lamp Quick Printer Initiating Device quantity Random Access Memory Read Only Memory Second Cassette Feeder Switching Mode Power Supply Samsung Printer Graphic Processor Samsung Printer Language Simultaneous Peripheral Operation Online switch synchronous or synchronization Universal Serial Bus Service Manual 2-2 Samsung Electronics