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Seagate ST1.2 ST1.2 Series Product Manual - Page 18

Shock, 8.5.1, Operating shock, 8.5.2, Nonoperating shock, Vibration

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2.8.5 Shock All shock measurements in this section are carried out at drive level. For all linear shock test, operating or nonoperating, the input shock level shall be measured at the frame of the disk drive at the specific location indicated by the red ellipse in Figure 6 below for the CF and interface drives. Finger Grip Area S1.2 CF interface drive S1.2 FX interface drive Figure 6. Location where tri-axial accelerometer will be placed on ST1.2 drive All shock test will cover all the 6 directions, +/- x, y and z axes. The drive axis definition in shown in Figure 7 below. -z -x -z -x -y -y Figure 7. +y +x +z S1.2 CF interface drive Drive axis definition for ST1.2 drives +y +x +z S1.2 FX interface drive 2.8.5.1 Operating shock The drive will be subjected to 10 shocks for each direction. During the shocks, there must be a minimum delay of 3 seconds between shock pulses. Soft errors and automatic retries are allowed during the test. No data loss or permanent damage occurs during a half sine shock pulse of: 200 Gs, 1 msec (on-track read at OD) 175 Gs, 2 msec (random write) 2.8.5.2 Nonoperating shock The nonoperating shock level that the drive can experience without incurring any physical damage when subsequently put into operation is 750 Gs based on a non-repetitive half sine shock pulse of 2 msec duration. The same applies for shock levels of 1500 Gs, 1 msec pulse duration and 1500 Gs, 0.5 msec pulse duration on fresh drives for each level. 2.8.6 Vibration All vibration specifications assume that the drive is mounted securely in a fixture that does not have fixture resonances in the frequency test range. The input vibration is applied through the disc drive guide rails of the device under test. Testing is carried out in the x, y and z axes. 12 ST1.2 Series Product Manual, Rev. B

Section	Page
1.0 Introduction 1	3
1.1 Disclaimer 2	3
1.2 Drive care 2	3
1.3 Handling precautions 2	3
2.0 Drive specifications 3	3
2.1 Power, access times and acoustics 3	3
2.2 Formatted capacity 5	3
2.3 Default logical geometry 5	3
2.4 Recording and interface technology 6	3
2.5 Physical characteristics 6	3
2.6 Time to ready 6	3
2.7 Power specifications 7	3
2.7.1 Power consumption 7	3
2.7.2 Conducted noise 9	3
2.7.3 Voltage tolerance 9	3
2.7.4 Power-management modes 10	3
2.8 Environmental specifications 11	3
2.8.1 Ambient temperature 11	3
2.8.2 Temperature gradient 11	3
2.8.3 Humidity 11	3
2.8.4 Altitude 11	3
2.8.5 Shock 12	3
2.8.6 Vibration 12	3
2.9 Acoustics 15	3
2.10 Electromagnetic immunity 15	3
2.11 Reliability 16	3
2.12 Agency certification 17	3
2.12.1 Safety certification 17	3
2.12.2 Electromagnetic compatibility 17	3
2.12.3 European Union Restriction of Hazardous Substances (RoHS) Directive 17	3
2.12.4 China Restriction of Hazardous Substances (RoHS) Directive 18	3
2.12.5 FCC verification 18	3
3.0 Configuring and mounting the drive 21	3
3.1 Handling and static discharge precautions 21	3
3.2 Drive installation 22	3
4.0 Interface description 25	3
4.1 Connector interface signals and connector pins 25	3
4.1.1 Flex interface connector signals 27	3
4.1.2 Supported ATA commands 29	3
4.1.3 Identify Device command 31	3
4.1.4 Set Features command 35	3
4.1.5 Card Information Structure (CIS) information for CF 37	3
5.0 Seagate Technology support services 49	3
Figure 1. ST1.2 Series CompactFlash+ disc drive 1	5
Figure 2. ST1.2 Series Flex (IDE interface) disc drive 1	5
Figure 3. ST1.2 Series breather hole location 2	5
Figure 4. ST1.2 Series improper handling example 2	5
Figure 5. Typical 3.3V startup and operation current profile 8	5
Figure 6. Location where tri-axial accelerometer will be placed on ST1.2 drive 12	5
Figure 7. Drive axis definition for ST1.2 drives 12	5
Figure 8. ST1.2 Series proper handling example 21	5
Figure 9. ST1.2 Series improper handling example 21	5
Figure 10. CF model mechanical dimensions-top, side and end view 22	5
Figure 11. FX model mechanical dimensions-top, side and end view 23	5
1.0 Introduction	7
1.1 Disclaimer	8
1.2 Drive care	8
1.3 Handling precautions	8
2.0 Drive specifications	9
2.1 Power, access times and acoustics	9
2.2 Formatted capacity	11
2.3 Default logical geometry	11
2.4 Recording and interface technology	12
2.5 Physical characteristics	12
2.6 Time to ready	12
2.7 Power specifications	13
2.7.1 Power consumption	13
2.7.1.1 Typical current profile	14
2.7.2 Conducted noise	15
2.7.3 Voltage tolerance	15
2.7.4 Power-management modes	16
2.8 Environmental specifications	17
2.8.1 Ambient temperature	17
2.8.2 Temperature gradient	17
2.8.3 Humidity	17
2.8.3.1 Relative humidity	17
2.8.3.2 Wet bulb temperature	17
2.8.4 Altitude	17
2.8.5 Shock	18
2.8.5.1 Operating shock	18
2.8.5.2 Nonoperating shock	18
2.8.6 Vibration	18
2.8.6.1 Operating sweep sine vibration	19
2.8.6.2 Operating random vibration	19
2.8.6.3 Nonoperating sweep sine vibration	19
2.8.6.4 Nonoperating random vibration	20
2.8.6.5 Corrosive environment	20
2.9 Acoustics	21
2.10 Electromagnetic immunity	21
2.11 Reliability	22
2.12 Agency certification	23
2.12.1 Safety certification	23
2.12.2 Electromagnetic compatibility	23
2.12.3 European Union Restriction of Hazardous Substances (RoHS) Directive	23
2.12.4 China Restriction of Hazardous Substances (RoHS) Directive	24
2.12.5 FCC verification	24
3.0 Configuring and mounting the drive	27
3.1 Handling and static discharge precautions	27
3.2 Drive installation	28
4.0 Interface description	31
4.1 Connector interface signals and connector pins	31
4.1.1 Flex interface connector signals	33
4.1.2 Supported ATA commands	35
4.1.3 Identify Device command	37
4.1.4 Set Features command	41
4.1.5 Card Information Structure (CIS) information for CF	43
5.0 Seagate Technology support services	55
Index	61
A	61
B	61
C	61
D	61
E	61
F	61
G	61
H	61
I	61
K	61
L	61
M	62
N	62
O	62
P	62
R	62
S	62
T	62
V	62

Match case Limit results 1 per page

ST1.2 Series Product Manual, Rev. B

2.8.5

Shock

All shock measurements in this section are carried out at drive level. For all linear shock test, operating or non-

operating, the input shock level shall be measured at the frame of the disk drive at the specific location indi-

cated by the red ellipse in Figure 6 below for the CF and interface drives.

Figure 6.

Location where tri-axial accelerometer will be placed on ST1.2 drive

All shock test will cover all the 6 directions, +/- x, y and z axes. The drive axis definition in shown in Figure 7

below.

Figure 7.

Drive axis definition for ST1.2 drives

2.8.5.1

Operating shock

The drive will be subjected to 10 shocks for each direction. During the shocks, there must be a minimum delay

of 3 seconds between shock pulses. Soft errors and automatic retries are allowed during the test. No data loss

or permanent damage occurs during a half sine shock pulse of:

200 Gs, 1 msec (on-track read at OD)

175 Gs, 2 msec (random write)

2.8.5.2

Nonoperating shock

The nonoperating shock level that the drive can experience without incurring any physical damage when sub-

sequently put into operation is 750 Gs based on a non-repetitive half sine shock pulse of 2 msec duration. The

same applies for shock levels of 1500 Gs, 1 msec pulse duration and 1500 Gs, 0.5 msec pulse duration on

fresh drives for each level.

2.8.6

Vibration

All vibration specifications assume that the drive is mounted securely in a fixture that does not have fixture

resonances in the frequency test range. The input vibration is applied through the disc drive guide rails of the

device under test. Testing is carried out in the x, y and z axes.

S1.2 FX interface drive

S1.2 CF interface drive

Finger

Grip Area

S1.2 CF interface drive

S1.2 FX interface drive

-y

-x

-z

-y

-x

-z