Seagate ST33000651SS Constellation ES.1 SAS Product Manual - Page 60

Cooling

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11.2 Cooling Cabinet cooling must be designed by the customer so that the ambient temperature immediately surrounding the drive will not exceed temperature conditions specified in Section 7.5.1, "Temperature." The rack, cabinet, or drawer environment for the drive must provide heat removal from the electronics and head and disk assembly (HDA). You should confirm that adequate heat removal is provided using the temperature measurement guidelines described in Section 7.5.1. Forced air flow may be required to keep temperatures at or below the temperatures specified in Section 7.5.1 in which case the drive should be oriented, or air flow directed, so that the least amount of air flow resistance is created while providing air flow to the electronics and HDA. Also, the shortest possible path between the air inlet and exit should be chosen to minimize the travel length of air heated by the drive and other heat sources within the rack, cabinet, or drawer environment. If forced air is determined to be necessary, possible air-flow patterns are shown in Figure 15. The air-flow patterns are created by one or more fans, either forcing or drawing air as shown in the illustrations. Conduction, convection, or other forced air-flow patterns are acceptable as long as the temperature measurement guidelines of Section 7.5.1 are met. b Note. l (b (b b Note. l ( Figure 15. Air flow 52 Constellation ES.1 SAS Product Manual, Rev. E

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52
Constellation ES.1 SAS Product Manual, Rev. E
11.2
Cooling
Cabinet cooling must be designed by the customer so that the ambient temperature immediately surrounding
the drive will not exceed temperature conditions specified in Section 7.5.1, "Temperature."
The rack, cabinet, or drawer environment for the drive must provide heat removal from the electronics and
head and disk assembly (HDA). You should confirm that adequate heat removal is provided using the temper-
ature measurement guidelines described in Section 7.5.1.
Forced air flow may be required to keep temperatures at or below the temperatures specified in Section 7.5.1
in which case the drive should be oriented, or air flow directed, so that the least amount of air flow resistance is
created while providing air flow to the electronics and HDA. Also, the shortest possible path between the air
inlet and exit should be chosen to minimize the travel length of air heated by the drive and other heat sources
within the rack, cabinet, or drawer environment.
If forced air is determined to be necessary, possible air-flow patterns are shown in Figure 15. The air-flow pat-
terns are created by one or more fans, either forcing or drawing air as shown in the illustrations. Conduction,
convection, or other forced air-flow patterns are acceptable as long as the temperature measurement guide-
lines of Section 7.5.1 are met.
Figure 15.
Air flow
b
Note.
l
(b
(
b
b
Note.
l
(