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Cooling

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9.2 Cooling Cabinet cooling must be designed by the customer so that the ambient temperature immediately surrounding the drive will not exceed temperature conditions specified in Section 6.5.1, "Temperature." The rack, cabinet, or drawer environment for the drive must provide heat removal from the electronics and head and disc assembly (HDA). You should confirm that adequate heat removal is provided using the temperature measurement guidelines described in Section 6.5.1. Forced air flow may be required to keep temperatures at or below the temperatures specified in Section 6.5.1 in which case the drive should be oriented, or air flow directed, so that the least amount of air flow resistance is created while providing air flow to the electronics and HDA. Also, the shortest possible path between the air inlet and exit should be chosen to minimize the travel length of air heated by the drive and other heat sources within the rack, cabinet, or drawer environment. If forced air is determined to be necessary, possible air-flow patterns are shown in Figure 26. The air-flow patterns are created by one or more fans, either forcing or drawing air as shown in the illustrations. Conduction, convection, or other forced air-flow patterns are acceptable as long as the temperature measurement guidelines of Section 6.5.1 are met. Above unit Under unit Note. Air flows in the direction shown (back to front) or in reverse direction (front to back) Note. Air flows in the direction shown or in reverse direction (side to side) Figure 26. Air flow Above unit Under unit Note. Image of the HDA may not represent actual product, for reference only. Savvio 10K.4 SAS Product Manual, Rev. C 47

Section	Page
1.0 Scope	9
2.0 Applicable standards and reference documentation	10
2.1 Standards	10
2.1.1 Electromagnetic compatibility	10
2.1.1.1 Electromagnetic susceptibility	10
2.1.2 Electromagnetic compliance	11
2.1.3 European Union Restriction of Hazardous Substances (RoHS)	12
2.2 Reference documents	12
3.0 General description	13
3.1 Standard features	14
3.2 Media description	14
3.3 Performance	15
3.4 Reliability	15
3.5 Formatted capacities	15
3.6 Programmable drive capacity	15
3.7 Factory-installed options	16
4.0 Performance characteristics	17
4.1 Internal drive characteristics	17
4.2 Seek performance characteristics	17
4.2.1 Access time	17
4.2.2 Format command execution time for 512-byte sectors (minutes)	18
4.2.3 General performance characteristics	18
4.3 Start/stop time	18
4.4 Prefetch/multi-segmented cache control	19
4.5 Cache operation	19
4.5.1 Caching write data	19
4.5.2 Prefetch operation	20
5.0 Reliability specifications	21
5.1 Error rates	21
5.1.1 Recoverable Errors	21
5.1.2 Unrecoverable Errors	21
5.1.3 Seek errors	22
5.1.4 Interface errors	22
5.2 Reliability and service	22
5.2.1 Annualized Failure Rate (AFR) and Mean Time Between Failure (MTBF)	22
5.2.2 Preventive maintenance	22
5.2.3 Hot plugging the drive	22
5.2.4 S.M.A.R.T.	23
5.2.5 Thermal monitor	24
5.2.6 Drive Self Test (DST)	25
5.2.6.1 DST failure definition	25
5.2.6.2 Implementation	25
5.2.7 Product warranty	27
6.0 Physical/electrical specifications	28
6.1 PowerChoiceTM power management	28
6.1.1 PowerChoice reporting methods	29
6.2 AC power requirements	29
6.3 DC power requirements	29
6.3.1 Conducted noise immunity	33
6.3.2 Power sequencing	33
6.3.3 Current profiles	34
6.4 Power dissipation	36
6.5 Environmental limits	39
6.5.1 Temperature	39
6.5.2 Relative humidity	40
6.5.3 Effective altitude (sea level)	40
6.5.4 Shock and vibration	40
6.5.4.1 Shock	41
6.5.4.2 Vibration	43
6.5.5 Air cleanliness	43
6.5.6 Corrosive environment	43
6.5.7 Acoustics	44
6.5.8 Electromagnetic susceptibility	44
6.6 Mechanical specifications	45
7.0 About self-encrypting drives	46
7.1 Data encryption	46
7.2 Controlled access	46
7.2.1 Admin SP	46
7.2.2 Locking SP	47
7.2.3 Default password	47
7.3 Random number generator (RNG)	47
7.4 Drive locking	47
7.5 Data bands	47
7.6 Cryptographic erase	48
7.7 Authenticated firmware download	48
7.8 Power requirements	48
7.9 Supported commands	48
8.0 Defect and error management	49
8.1 Drive internal defects/errors	49
8.2 Drive error recovery procedures	49
8.3 SAS system errors	50
8.4 Background Media Scan	51
8.5 Media Pre-Scan	51
8.6 Deferred Auto-Reallocation	51
8.7 Idle Read After Write	52
8.8 Protection Information (PI)	52
8.8.1 Levels of PI	52
8.8.2 Setting and determining the current Type Level	52
8.8.3 Identifying a Protection Information drive	53
9.0 Installation	54
9.1 Drive orientation	54
9.2 Cooling	55
9.3 Drive mounting	56
9.4 Grounding	56
10.0 Interface requirements	57
10.1 SAS features	57
10.1.1 task management functions	57
10.1.2 task management responses	57
10.2 Dual port support	58
10.3 SCSI commands supported	59
10.3.1 Inquiry data	63
10.3.2 Mode Sense data	63
10.4 Miscellaneous operating features and conditions	67
10.4.1 SAS physical interface	68
10.4.2 Physical characteristics	71
10.4.3 Connector requirements	71
10.4.4 Electrical description	71
10.4.5 Pin descriptions	71
10.4.6 SAS transmitters and receivers	72
10.4.7 Power	72
10.5 Signal characteristics	72
10.5.1 Ready LED Out	72
10.5.2 Differential signals	73
10.6 SAS-2 Specification compliance	73
10.7 Additional information	73
11.0 Seagate Technology support services	74
Numerics	77
A	77
B	77
C	77
D	77
E	78
F	78
G	78
H	78
I	78
J	78
K	78
L	78
M	79
N	79
O	79
P	79
Q	79
R	80
S	80
T	80
U	81
V	81
W	81

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Savvio 10K.4 SAS Product Manual, Rev. C

9.2

Cooling

Cabinet cooling must be designed by the customer so that the ambient temperature immediately surrounding

the drive will not exceed temperature conditions specified in Section 6.5.1, "Temperature."

The rack, cabinet, or drawer environment for the drive must provide heat removal from the electronics and

head and disc assembly (HDA). You should confirm that adequate heat removal is provided using the temper-

ature measurement guidelines described in Section 6.5.1.

Forced air flow may be required to keep temperatures at or below the temperatures specified in Section 6.5.1

in which case the drive should be oriented, or air flow directed, so that the least amount of air flow resistance is

created while providing air flow to the electronics and HDA. Also, the shortest possible path between the air

inlet and exit should be chosen to minimize the travel length of air heated by the drive and other heat sources

within the rack, cabinet, or drawer environment.

If forced air is determined to be necessary, possible air-flow patterns are shown in Figure 26. The air-flow pat-

terns are created by one or more fans, either forcing or drawing air as shown in the illustrations. Conduction,

convection, or other forced air-flow patterns are acceptable as long as the temperature measurement guide-

lines of Section 6.5.1 are met.

Figure 26.

Air flow

Note.

Image of the HDA may not represent actual product, for reference only.

Above unit

Under unit

Note.

Air flows in the direction shown (back to front)

or in reverse direction (front to back)

Above unit

Under unit

Note.

Air flows in the direction shown or

in reverse direction (side to side)