ASRock H170 Combo User Manual - Page 7
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1.2 Speciications Platform • ATX Form Factor • Solid Capacitor design CPU • Supports 6th Generation Intel® CoreTM i7/i5/i3/Pentium®/ Celeron® Processors (Socket 1151) • Digi Power design • 10 Power Phase design • Supports Intel® Turbo Boost 2.0 Technology Chipset • Intel® H170 • Supports Intel® Small Business Advantage 4.0 Memory • Dual Channel DDR4/DDR3/DDR3L Memory Technology • 2 x DDR4 DIMM Slots • Supports DDR4 2133 non-ECC, un-bufered memory • Max. capacity of system memory: 32GB • Supports Intel® Extreme Memory Proile (XMP) 2.0 • 15μ Gold Contact in DDR4 DIMM Slots • 4 x DDR3/DDR3L DIMM Slots • Supports DDR3/DDR3L 1866(OC)/1600/1333/1066 non- ECC, un-bufered memory * Supports 2 x DDR3/DDR3L memory modules up to 1866(OC) and 4 x DDR3/DDR3L memory modules up to 1333 * Please refer to Memory Support List on ASRock's website for more information. (http://www.asrock.com/) • Max. capacity of system memory: 64GB Expansion Slot • 2 x PCI Express 3.0 x16 Slots (PCIE2: x16 mode; PCIE4: x4 mode)* * Supports NVMe SSD as boot disks • 2 x PCI Express 3.0 x1 Slots (Flexible PCIe) • 2 x PCI Slots * PCI cards that need subtractive decode are not supported. • Supports AMD Quad CrossFireXTM and CrossFireXTM English 2