Intel BLKDP965LTCK Product Specification - Page 9

Regulatory Compliance and Battery Disposal Information, s, Tables

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Contents 5 Regulatory Compliance and Battery Disposal Information 5.1 Regulatory Compliance 83 5.1.1 Safety Regulations 83 5.1.2 European Union Declaration of Conformity Statement 84 5.1.3 Product Ecology Statements 86 5.1.4 EMC Regulations 89 5.1.5 Product Certification Markings (Board Level 90 5.2 Battery Disposal Information 91 Figures 1. Major Board Components 14 2. Block Diagram 16 3. Memory Channel and DIMM Configuration 21 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs 22 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ......... 22 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs 23 7. Single Channel (Asymmetric) Mode Configuration with One DIMM .......... 24 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs....... 24 9. Flex Mode Configuration with Two DIMMs 25 10. LAN Connector LED Locations 33 12. Thermal Sensors and Fan Headers 35 13. Location of the Standby Power Indicator LED 41 14. Detailed System Memory Address Map 44 15. Back Panel Connectors 51 16. Component-side Connectors and Headers 52 17. Connection Diagram for Front Panel Header 57 18. Connection Diagram for Front Panel USB Headers 59 19. Connection Diagram for IEEE 1394a Header 59 20. Location of the Jumper Block 60 21. Board Dimensions 61 22. I/O Shield Dimensions 62 23. Localized High Temperature Zones 66 Tables 1. Feature Summary 12 2. Board Components Shown in Figure 1 15 3. Supported Memory Configurations 18 4. Memory Operating Frequencies 19 5. Audio Jack Retasking Support 30 6. LAN Connector LED States 33 7. Effects of Pressing the Power Switch 36 8. Power States and Targeted System Power 37 9. Wake-up Devices and Events 38 10. System Memory Map 45 11. DMA Channels 45 ix

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Contents
ix
5
Regulatory Compliance and Battery Disposal Information
5.1
Regulatory Compliance
.....................................................................
83
5.1.1
Safety Regulations
................................................................
83
5.1.2
European Union Declaration of Conformity Statement
................
84
5.1.3
Product Ecology Statements
...................................................
86
5.1.4
EMC Regulations
..................................................................
89
5.1.5
Product Certification Markings (Board Level)
.............................
90
5.2
Battery Disposal Information
.............................................................
91
Figures
1.
Major Board Components
..................................................................
14
2.
Block Diagram
................................................................................
16
3.
Memory Channel and DIMM Configuration
...........................................
21
4.
Dual Channel (Interleaved) Mode Configuration with Two DIMMs
............
22
5.
Dual Channel (Interleaved) Mode Configuration with Three DIMMs
.........
22
6.
Dual Channel (Interleaved) Mode Configuration with Four DIMMs
...........
23
7.
Single Channel (Asymmetric) Mode Configuration with One DIMM
..........
24
8.
Single Channel (Asymmetric) Mode Configuration with Three DIMMs
.......
24
9.
Flex Mode Configuration with Two DIMMs
............................................
25
10. LAN Connector LED Locations
............................................................
33
12. Thermal Sensors and Fan Headers
.....................................................
35
13. Location of the Standby Power Indicator LED
.......................................
41
14. Detailed System Memory Address Map
...............................................
44
15. Back Panel Connectors
.....................................................................
51
16. Component-side Connectors and Headers
...........................................
52
17. Connection Diagram for Front Panel Header
........................................
57
18. Connection Diagram for Front Panel USB Headers
................................
59
19. Connection Diagram for IEEE 1394a Header
........................................
59
20. Location of the Jumper Block
.............................................................
60
21. Board Dimensions
...........................................................................
61
22. I/O Shield Dimensions
......................................................................
62
23. Localized High Temperature Zones
.....................................................
66
Tables
1.
Feature Summary
............................................................................
12
2.
Board Components Shown in Figure 1
................................................
15
3.
Supported Memory Configurations
.....................................................
18
4.
Memory Operating Frequencies
.........................................................
19
5.
Audio Jack Retasking Support
...........................................................
30
6.
LAN Connector LED States
................................................................
33
7.
Effects of Pressing the Power Switch
..................................................
36
8.
Power States and Targeted System Power
...........................................
37
9.
Wake-up Devices and Events
............................................................
38
10.
System Memory Map
.......................................................................
45
11.
DMA Channels
.................................................................................
45