Intel CORE2DUO/T7300 Mechanical Design Guidelines - Page 23

Processor Thermal/Mechanical Information

Thermal and Mechanical Design Guidelines

23

In addition to passive heatsinks, fan heatsinks and system fans are other solutions

that exist for cooling integrated circuit devices. For example, ducted blowers, heat

pipes, and liquid cooling are all capable of dissipating additional heat. Due to their

varying attributes, each of these solutions may be appropriate for a particular system

implementation.

To develop a reliable, cost-effective thermal solution, thermal characterization and

simulation should be carried out at the entire system level, accounting for the thermal

requirements of each component. In addition, acoustic noise constraints may limit the

size, number, placement, and types of fans that can be used in a particular design.

To ease the burden on thermal solutions, the Thermal Monitor feature and associated

logic have been integrated into the silicon of the processor. By taking advantage of

the Thermal Monitor feature, system designers may reduce thermal solution cost by

designing to TDP instead of maximum power. Thermal Monitor attempts to protect the

processor during sustained workload above TDP. Implementation options and

recommendations are described in Chapter 4.

2.4.3

Summary

In summary, considerations in heatsink design include:

•

The local ambient temperature T

A

at the heatsink, which is a function of chassis

design.

•

The thermal design power (TDP) of the processor, and the corresponding

maximum T

C

as calculated from the thermal profile. These parameters are usually

combined in a single lump cooling performance parameter,

Ψ

CA

(case to air

thermal characterization parameter). More information on the definition and the

use of

Ψ

CA

is given Section 3.1.

•

Heatsink interface to IHS surface characteristics, including flatness and roughness.

•

The performance of the thermal interface material used between the heatsink and

the IHS.

•

The required heatsink clip static load, between 18 lbf to 70 lbf throughout the life

of the product (Refer to Section 2.1.2.2 for further information).

•

Surface area of the heatsink.

•

Heatsink material and technology.

•

Volume of airflow over the heatsink surface area.

•

Development of airflow entering and within the heatsink area.

•

Physical volumetric constraints placed by the system

2.5

System Integration Considerations

Manufacturing with Intel

®

Components using 775–Land LGA Package and LGA775

Socket

documentation provides Best Known Methods for all aspects LGA775 socket

based platforms and systems manufacturing. Of particular interest for package and

heatsink installation and removal is the

System Assembly

module. A video covering

system integration is also available. Contact your Intel field sales representative for

further information.

§

Section	Page
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	11
2 Processor Thermal/Mechanical Information	13
2.1 Mechanical Requirements	13
2.1.1 Processor Package	13
2.1.2 Heatsink Attach	15
2.1.2.1 General Guidelines	15
2.1.2.2 Heatsink Clip Load Requirement	15
2.1.2.3 Additional Guidelines	16
2.2 Thermal Requirements	16
2.2.1 Processor Case Temperature	16
2.2.2 Thermal Profile	17
2.2.3 Thermal Solution Design Requirements	17
2.2.4 TCONTROL	18
2.3 Heatsink Design Considerations	19
2.3.1 Heatsink Size	20
2.3.2 Heatsink Mass	20
2.3.3 Package IHS Flatness	21
2.3.4 Thermal Interface Material	21
2.4 System Thermal Solution Considerations	22
2.4.1 Chassis Thermal Design Capabilities	22
2.4.2 Improving Chassis Thermal Performance	22
2.4.3 Summary	23
2.5 System Integration Considerations	23
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.2.1 Thermal Monitor	32
4.2.3 Thermal Monitor 2	33
4.2.4 Operation and Configuration	34
4.2.5 On-Demand Mode	35
4.2.6 System Considerations	35
4.2.7 Operating System and Application Software Considerations	36
4.2.8 THERMTRIP# Signal	36
4.2.9 Cooling System Failure Warning	36
4.2.10 Digital Thermal Sensor	37
4.2.11 Platform Environmental Control Interface (PECI)	38
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information	39
5.1 Overview of the BTX Reference Design	39
5.1.1 Target Heatsink Performance	39
5.1.2 Acoustics	40
5.1.3 Effective Fan Curve	41
5.1.4 Voltage Regulator Thermal Management	42
5.1.5 Altitude	43
5.1.6 Reference Heatsink Thermal Validation	43
5.2 Environmental Reliability Testing	43
5.2.1 Structural Reliability Testing	43
5.2.1.1 Random Vibration Test Procedure	43
5.2.1.2 Shock Test Procedure	44
5.2.2 Power Cycling	45
5.2.3 Recommended BIOS/CPU/Memory Test Procedures	46
5.3 Material and Recycling Requirements	46
5.4 Safety Requirements	47
5.5 Geometric Envelope for Intel® Reference BTX Thermal Module Assembly	47
5.6 Preload and TMA Stiffness	48
5.6.1 Structural Design Strategy	48
5.6.2 TMA Preload verse Stiffness	48
6 ATX Thermal/Mechanical Design Information	51
6.1 ATX Reference Design Requirements	51
6.2 Validation Results for Reference Design	53
6.2.1 Heatsink Performance	53
6.2.2 Acoustics	54
6.2.3 Altitude	54
6.2.4 Heatsink Thermal Validation	55
6.3 Environmental Reliability Testing	55
6.3.1 Structural Reliability Testing	55
6.3.1.1 Random Vibration Test Procedure	55
6.3.1.2 Shock Test Procedure	56
6.3.2 Power Cycling	57
6.3.3 Recommended BIOS/CPU/Memory Test Procedures	58
6.4 Material and Recycling Requirements	58
6.5 Safety Requirements	59
6.6 Geometric Envelope for Intel® Reference ATX Thermal Mechanical Design	59
6.7 Reference Attach Mechanism	60
6.7.1 Structural Design Strategy	60
6.7.2 Mechanical Interface to the Reference Attach Mechanism	61
7 Intel® Quiet System Technology (Intel® QST)	63
7.1 Intel® QST Algorithm	63
7.1.1 Output Weighting Matrix	64
7.1.2 Proportional-Integral-Derivative (PID)	64
7.2 Board and System Implementation of Intel® QST	66
7.3 Intel® QST Configuration and Tuning	68

Intel CORE2DUO/T7300 Mechanical Design Guidelines - Page 23

System Integration Considerations

Page 23 highlights